Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
STW20NM60 STMicroelectronics	MOSFET N-CH 600V 20A TO247-3	631
STU16N60M2 STMicroelectronics	MOSFET N-CH 600V 12A IPAK	0
STP15NK50ZFP STMicroelectronics	MOSFET N-CH 500V 14A TO220FP	0
STB24N65M2 STMicroelectronics	MOSFET N-CH 650V 16A D2PAK	0
STH130N8F7-2 STMicroelectronics	MOSFET N-CH 80V 110A H2PAK-2	0
STW15NM60N STMicroelectronics	MOSFET N-CH 600V 14A TO247-3	0
IRF630 STMicroelectronics	MOSFET N-CH 200V 9A TO220AB	8166
STD6N62K3 STMicroelectronics	MOSFET N-CH 620V 5.5A DPAK	5837
STL16N65M5 STMicroelectronics	MOSFET N-CH 650V 12A PWRFLAT HV	0
STH310N10F7-6 STMicroelectronics	MOSFET N-CH 100V 180A H2PAK-6	0
STD65N3LLH5 STMicroelectronics	MOSFET N CH 30V 65A DPAK	21
STF10NM60N STMicroelectronics	MOSFET N-CH 600V 10A TO220FP	479
STL30P3LLH6 STMicroelectronics	MOSFET P-CH 30V 30A POWERFLAT	6669
STD120N4LF6 STMicroelectronics	MOSFET N-CH 40V 80A DPAK	1742
STD7N65M6 STMicroelectronics	MOSFET N-CH 650V 5A DPAK	0
STP18N60M6 STMicroelectronics	MOSFET N-CH 600V 13A TO220	0
STF22NM60N STMicroelectronics	MOSFET N-CH 600V 16A TO220FP	985
STF4N62K3 STMicroelectronics	MOSFET N-CH 620V 3.8A TO220FP	0
STL26NM60N STMicroelectronics	MOSFET N-CH 600V 19A POWERFLAT	0
STE70NM60 STMicroelectronics	MOSFET N-CH 600V 70A ISOTOP	0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS