Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
STP32N65M5 STMicroelectronics	MOSFET N-CH 650V 24A TO220AB	370
STH140N6F7-2 STMicroelectronics	MOSFET N-CH 60V 80A H2PAK-2	0
STL42P6LLF6 STMicroelectronics	MOSFET P-CH 60V 42A POWERFLAT	0
STD36P4LLF6 STMicroelectronics	MOSFET P-CH 40V 36A DPAK	3610
STD6N65M2 STMicroelectronics	MOSFET N-CH 650V 4A DPAK	2391
STP165N10F4 STMicroelectronics	MOSFET N-CH 100V 120A TO220AB	498
STP11NK50ZFP STMicroelectronics	MOSFET N-CH 500V 10A TO220FP	1969
STP315N10F7 STMicroelectronics	MOSFET N-CH 100V 180A TO220	0
STB26NM60ND STMicroelectronics	MOSFET N-CH 600V 21A D2PAK	0
STB27NM60ND STMicroelectronics	MOSFET N-CH 600V 21A D2PAK	85
STF27N60M2-EP STMicroelectronics	MOSFET N-CH 600V 20A TO220FP	866
STD3N62K3 STMicroelectronics	MOSFET N-CH 620V 2.7A DPAK	2226
STB11NK40ZT4 STMicroelectronics	MOSFET N-CH 400V 9A D2PAK	2532
STW10NK80Z STMicroelectronics	MOSFET N-CH 800V 9A TO247-3	974
STP3NK90Z STMicroelectronics	MOSFET N-CH 900V 3A TO220AB	913
STD30NF06T4 STMicroelectronics	MOSFET N-CH 60V 28A DPAK	1437
STS3P6F6 STMicroelectronics	MOSFET P-CH 60V 3A 8SOIC	0
STP26NM60N STMicroelectronics	MOSFET N-CH 600V 20A TO220AB	5250
STD180N4F6 STMicroelectronics	MOSFET N-CH 40V 80A DPAK	0
STR1P2UH7 STMicroelectronics	MOSFET P-CH 20V 1.4A SOT-23	990

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS