Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
STFI6N80K5 STMicroelectronics	MOSFET N-CH 800V 4.5A I2PAKFP	0
STP46NF30 STMicroelectronics	MOSFET N CH 300V 42A TO-220	0
STP120NF10 STMicroelectronics	MOSFET N-CH 100V 110A TO220AB	3995
STN1NF20 STMicroelectronics	MOSFET N-CH 200V 1A SOT-223	2566
STD85N10F7AG STMicroelectronics	MOSFET N-CH 100V 70A DPAK	0
STD4N62K3 STMicroelectronics	MOSFET N-CH 620V 3.8A DPAK	1482
SCT30N120 STMicroelectronics	SICFET N-CH 1200V 40A HIP247	580
STB28N60M2 STMicroelectronics	MOSFET N-CH 600V 22A D2PAK	181
STB60NF10-1 STMicroelectronics	MOSFET N-CH 100V 80A I2PAK	0
STFI10NK60Z STMicroelectronics	MOSFET N-CH 600V 10A I2PAKFP	0
STF34NM60N STMicroelectronics	MOSFET N-CH 600V 31.5A TO220FP	291
STW40N60M2 STMicroelectronics	MOSFET N-CH 600V 34A TO247	570
STF8N80K5 STMicroelectronics	MOSFET N-CH 800V 6A TO220FP	900
STQ2NK60ZR-AP STMicroelectronics	MOSFET N-CH 600V 400MA TO92-3	5507
STD100N10F7 STMicroelectronics	MOSFET N CH 100V 80A DPAK	11567
STW12N170K5 STMicroelectronics	MOSFET N-CH 1700V 5A TO247	36
STF16N50M2 STMicroelectronics	MOSFET N-CH 500V 13A TO220	890
STF20N65M5 STMicroelectronics	MOSFET N-CH 650V 18A TO220FP	37
STD150N3LLH6 STMicroelectronics	MOSFET N-CH 30V 80A DPAK	3122
STP9NM60N STMicroelectronics	MOSFET N-CH 600V 6.5A TO220AB	842

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS