Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
STL11N4LLF5 STMicroelectronics	MOSFET N-CH 40V 11A POWERFLAT	0
STL12N60M2 STMicroelectronics	MOSFET N-CH 600V 6.5A POWERFLAT	2323
STD5N95K3 STMicroelectronics	MOSFET N-CH 950V 4A DPAK	2124
STW75N60M6 STMicroelectronics	MOSFET N-CH 600V 72A TO247	0
STW56N65M2 STMicroelectronics	MOSFET N-CH 650V 49A TO247	696
STW34NM60N STMicroelectronics	MOSFET N-CH 600V 29A TO247-3	1610
STP52N25M5 STMicroelectronics	MOSFET N-CH 250V 28A TO220	0
STW52NK25Z STMicroelectronics	MOSFET N-CH 250V 52A TO247-3	1199
STF40N65M2 STMicroelectronics	MOSFET N-CH 650V 32A TO220FP	72
STP7N105K5 STMicroelectronics	MOSFET N-CH 1050V 4A TO220	1245
STD44N4LF6 STMicroelectronics	MOSFET N-CH 40V 44A DPAK	6
STY105NM50N STMicroelectronics	MOSFET N-CH 500V 110A MAX247	0
STB33N60DM2 STMicroelectronics	MOSFET N-CH 600V 24A D2PAK	287
STK820 STMicroelectronics	MOSFET N-CH 25V 21A POLARPAK	0
STD20NF06T4 STMicroelectronics	MOSFET N-CH 60V 24A DPAK	438
STB170NF04 STMicroelectronics	MOSFET N-CH 40V 80A D2PAK	0
STP7NK40ZFP STMicroelectronics	MOSFET N-CH 400V 5.4A TO220FP	987
STP17N80K5 STMicroelectronics	MOSFET N-CHANNEL 800V 14A TO220	0
STI6N80K5 STMicroelectronics	MOSFET N-CH 800V 4.5A I2PAK	0
STL2N80K5 STMicroelectronics	MOSFET N-CH 800V 2A POWERFLAT	1700

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS