Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
RM60N75LD

RM60N75LD

Rectron USA

MOSFET N-CHANNEL 75V 60A TO252-2

0

RM42P30DN

RM42P30DN

Rectron USA

MOSFET P-CHANNEL 30V 42A 8DFN

0

RM80N20DN

RM80N20DN

Rectron USA

MOSFET N-CHANNEL 20V 80A 8PPAK

0

RM35P30LDV

RM35P30LDV

Rectron USA

MOSFET P-CHANNEL 30V 35A TO252-2

0

RM11N800T2

RM11N800T2

Rectron USA

MOSFET N-CH 800V 11A TO220-3

0

RM8N700LD

RM8N700LD

Rectron USA

MOSFET N-CHANNEL 700V 8A TO252-2

0

RM70P30DF

RM70P30DF

Rectron USA

MOSFET P-CHANNEL 30V 70A 8DFN

0

RM8N650T2

RM8N650T2

Rectron USA

MOSFET N-CHANNEL 650V 8A TO220-3

0

RM150N100HD

RM150N100HD

Rectron USA

MOSFET N-CH 100V 150A TO263-2

0

RM6N100S4

RM6N100S4

Rectron USA

MOSFET N-CH 100V 6A SOT223-3

0

RM2301E

RM2301E

Rectron USA

MOSFET P-CHANNEL 20V 2.6A SOT23

0

RM60P60HD

RM60P60HD

Rectron USA

MOSFET P-CHANNEL 60V 61A TO263-2

0

RM2N650LD

RM2N650LD

Rectron USA

MOSFET N-CHANNEL 650V 2A TO252-2

0

RM2N650IP

RM2N650IP

Rectron USA

MOSFET N-CHANNEL 650V 2A TO251

0

RM3404

RM3404

Rectron USA

MOSFET N-CHANNEL 30V 5.8A SOT23

0

RM40N40LD

RM40N40LD

Rectron USA

MOSFET N-CHANNEL 40V 42A TO252-2

0

RM2A3P60S4

RM2A3P60S4

Rectron USA

MOSFET P-CH 60V 2.3A SOT223-3

0

RM45N600T7

RM45N600T7

Rectron USA

MOSFET N-CH 600V 44.5A TO247

0

RM45N60DF

RM45N60DF

Rectron USA

MOSFET N-CHANNEL 60V 45A 8DFN

0

RM130N30D3

RM130N30D3

Rectron USA

MOSFET N-CHANNEL 30V 130A 8DFN

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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