Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
RM25P30S8

RM25P30S8

Rectron USA

MOSFET P-CHANNEL 30V 25A 8SOP

0

RM6N100S4V

RM6N100S4V

Rectron USA

MOSFET N-CH 100V 6A SOT223-3

0

RM2304

RM2304

Rectron USA

MOSFET N-CHANNEL 30V 3.6A SOT23

0

RM75N60T2

RM75N60T2

Rectron USA

MOSFET N-CHANNEL 60V 75A TO220-3

0

RM8N650HD

RM8N650HD

Rectron USA

MOSFET N-CHANNEL 650V 8A TO263-2

0

RM2310

RM2310

Rectron USA

MOSFET N-CHANNEL 60V 3A SOT23

0

RM6N800HD

RM6N800HD

Rectron USA

MOSFET N-CHANNEL 800V 6A TO263-2

0

RM1216

RM1216

Rectron USA

MOSFET P-CHANNEL 12V 16A 6DFN

0

RM150N60HD

RM150N60HD

Rectron USA

MOSFET N-CH 60V 150A TO263-2

0

RM80N60DF

RM80N60DF

Rectron USA

MOSFET N-CHANNEL 60V 80A 8DFN

0

RM120N40T2

RM120N40T2

Rectron USA

MOSFET N-CH 40V 120A TO220-3

0

RM10N30D2

RM10N30D2

Rectron USA

MOSFET N-CH 30V 10A 6PQFN

0

RM5N650IP

RM5N650IP

Rectron USA

MOSFET N-CHANNEL 650V 5A TO251

0

RM2P60S2

RM2P60S2

Rectron USA

MOSFET P-CHANNEL 60V 1.9A SOT23

0

RM5N800IP

RM5N800IP

Rectron USA

MOSFET N-CHANNEL 800V 5A TO251

0

RM15P55LD

RM15P55LD

Rectron USA

MOSFET P-CHANNEL 55V 15A TO252-2

0

RM3139K

RM3139K

Rectron USA

MOSFET P-CH 20V 660MA SOT723

0

RM30N250DF

RM30N250DF

Rectron USA

MOSFET N-CHANNEL 250V 29A 8DFN

0

RM130N100T2

RM130N100T2

Rectron USA

MOSFET N-CH 100V 130A TO220-3

0

RM185N30DF

RM185N30DF

Rectron USA

MOSFET N-CHANNEL 30V 185A 8DFN

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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