Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
RM35N30DF

RM35N30DF

Rectron USA

MOSFET N-CHANNEL 30V 35A 8DFN

0

RM45P20D3

RM45P20D3

Rectron USA

MOSFET P-CHANNEL 19V 45A 8DFN

0

RM20N650TI

RM20N650TI

Rectron USA

MOSFET N-CHANNEL 650V 20A TO220F

0

RM3416

RM3416

Rectron USA

MOSFET N-CHANNEL 20V 6.5A SOT23

0

RM2305

RM2305

Rectron USA

MOSFET P-CH 20V 3A/4.1A SOT23

0

RM15N650TI

RM15N650TI

Rectron USA

MOSFET N-CHANNEL 650V 15A TO220F

0

RM2301

RM2301

Rectron USA

MOSFET P-CHANNEL 20V 3A SOT23

0

RM15P30S8

RM15P30S8

Rectron USA

MOSFET P-CHANNEL 30V 15A 8SOP

0

RM150N40DF

RM150N40DF

Rectron USA

MOSFET N-CHANNEL 40V 150A 8DFN

0

RM30P30D3

RM30P30D3

Rectron USA

MOSFET P-CHANNEL 30V 30A 8DFN

0

RM2309

RM2309

Rectron USA

MOSFET P-CHANNEL 30V 3.1A SOT23

0

RM50N60LD

RM50N60LD

Rectron USA

MOSFET N-CHANNEL 60V 50A TO252-2

0

RM60P04Y

RM60P04Y

Rectron USA

MOSFET P-CHANNEL 60V 4A SOT23

0

RM135N100HD

RM135N100HD

Rectron USA

MOSFET N-CH 100V 135A TO263-2

0

RM100N30DF

RM100N30DF

Rectron USA

MOSFET N-CHANNEL 30V 100A 8DFN

0

RM130N200T2

RM130N200T2

Rectron USA

MOSFET N-CH 200V 132A TO220-3

0

RM21N700TI

RM21N700TI

Rectron USA

MOSFET N-CHANNEL 700V 21A TO220F

0

RM2303

RM2303

Rectron USA

MOSFET P-CHANNEL 30V 2A SOT23

0

RM7N600LD

RM7N600LD

Rectron USA

MOSFET N-CHANNEL 600V 7A TO252-2

0

RM2306E

RM2306E

Rectron USA

MOSFET N-CHANNEL 30V 5.3A SOT23

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

RFQ BOM Call Skype Email
Top