Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
TWRPI-MMA6900

TWRPI-MMA6900

NXP Semiconductors

BOARD MEMS FOR TOWER SYSTEM

0

RD1986MMA2260D

RD1986MMA2260D

NXP Semiconductors

KIT SENSOR ACCEL MMA2260D TRIAX

0

DEMO1985MC34940E

DEMO1985MC34940E

NXP Semiconductors

KIT DEMO FOR MC34940E FAMILY

0

KIT3468MMA7455L

KIT3468MMA7455L

NXP Semiconductors

KIT EVALUATION FOR MMA7456L

0

LFSTBEB8491

LFSTBEB8491

NXP Semiconductors

BOARD EVAL FOR MMA8491Q

0

KIT3109MMA7260QE

KIT3109MMA7260QE

NXP Semiconductors

KIT EVAL FOR MMA7260Q

0

KITMPR121EVM

KITMPR121EVM

NXP Semiconductors

KIT EVALUATION MPR121

0

BRKT-STBC-AGM04

BRKT-STBC-AGM04

NXP Semiconductors

FRDM BOARD FORMMA8652/ MAG3110

0

RD3112MMA7260QE

RD3112MMA7260QE

NXP Semiconductors

BOARD DEMO STAR FOR MMA7260QT

0

KITMPL115A1SPI

KITMPL115A1SPI

NXP Semiconductors

KIT EVALUATION FOR PL115A1SP1

0

TWRPI-PROXIMITY

TWRPI-PROXIMITY

NXP Semiconductors

TOUCH BOARD EVALUATION

0

LFSTBEB8450

LFSTBEB8450

NXP Semiconductors

BOARD DEV ACCELEROMETER MMA8450

0

LFSTBEB865X

LFSTBEB865X

NXP Semiconductors

BOARD EVAL FOR MMA865XFC

0

KITMPL115A1EVB

KITMPL115A1EVB

NXP Semiconductors

KIT EVALUATION FOR MPL115A1

0

KITMPVZ5004EVK

KITMPVZ5004EVK

NXP Semiconductors

KIT EVAL PRESSURE SENS BOARD

0

DEMOAPEXSENSOR

DEMOAPEXSENSOR

NXP Semiconductors

BOARD DESIGN ALTITUDE PRESSURE

0

KITMMA9551LEVM

KITMMA9551LEVM

NXP Semiconductors

BOARD DEV FOR MMA9551L

0

DEMOMC33941

DEMOMC33941

NXP Semiconductors

BOARD DEMO FOR MC33941 SENSOR

0

KIT1925MMA6231Q

KIT1925MMA6231Q

NXP Semiconductors

KIT SENSOR ACCEL MMA6231Q

0

RDMMA8491

RDMMA8491

NXP Semiconductors

KIT LFSTBEB8491/LFSTBUSB

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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