Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
RD4247FXOS8700

RD4247FXOS8700

NXP Semiconductors

KIT SENSOR TOOL BOX CONT

0

KITMPR083EVM

KITMPR083EVM

NXP Semiconductors

KIT EVAL 8POSITION ROTARY TOUCH

0

OM11055,598

OM11055,598

NXP Semiconductors

EVAL BOARD FOR PCF8883

0

KIT1925MMA1270D

KIT1925MMA1270D

NXP Semiconductors

KIT SENSOR ACCEL MMA1270D

0

DEMOMPR031

DEMOMPR031

NXP Semiconductors

BOARD DEMO FOR MPR031 CTLR

0

LFSTBEB845X

LFSTBEB845X

NXP Semiconductors

EVAL BOARD FOR MMA845XQ

0

LFSTBEB3110

LFSTBEB3110

NXP Semiconductors

KIT EVAL 3-AXIS DIG ACCELER

0

KIT1925MMA2260D

KIT1925MMA2260D

NXP Semiconductors

KIT SENSOR ACCEL MMA2260D

0

KIT3109MMA6270QE

KIT3109MMA6270QE

NXP Semiconductors

KIT EVAL FOR 1.5-6 XY-AXIS ACCEL

0

KIT3803MMA7660FC

KIT3803MMA7660FC

NXP Semiconductors

KIT EVALUATION FOR MMA7660FC

0

KITPRESSURE1EVB

KITPRESSURE1EVB

NXP Semiconductors

KIT EVALUATION SENSOR TOOLBOX

0

RDMMA865X

RDMMA865X

NXP Semiconductors

KIT SENSOR FOR MMA865XFC

0

KITMPL115A2I2C

KITMPL115A2I2C

NXP Semiconductors

KIT EVALUATION FOR PL115A2I2C

0

KITMC33941EVM

KITMC33941EVM

NXP Semiconductors

KIT EVAL W/MC33941 SENSOR

0

KITMPR084EVM

KITMPR084EVM

NXP Semiconductors

KIT EVAL 8-PAD TOUCH MPR084

0

TWR-SENSOR-PAK

TWR-SENSOR-PAK

NXP Semiconductors

TOWER SYSTEM SENSOR PAK

0

MED-EKG

MED-EKG

NXP Semiconductors

TOWER SYSTEM ELECTROCARDIOGRAM

0

TWRPITSS-SLIDERS

TWRPITSS-SLIDERS

NXP Semiconductors

HDWR TOWER MCU BOARD SLIDERS

0

KIT3376MMA7341L

KIT3376MMA7341L

NXP Semiconductors

KIT EVAL 3AXIS ANLG ACCELEROMETR

0

KIT1925MMA6262Q

KIT1925MMA6262Q

NXP Semiconductors

KIT SENSOR ACCEL MMA6262Q

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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