Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
OM11057,598

OM11057,598

NXP Semiconductors

DEMO PCF8885 PCF8536 PCA8886

0

RDFXWIN8USB

RDFXWIN8USB

NXP Semiconductors

BOARD REF XTRINSIC WINDOWS8

0

KIT3376MMA7361LC

KIT3376MMA7361LC

NXP Semiconductors

KIT EVAL 3AXIS ANLG ACCELEROMETR

0

DEMOMMA8491

DEMOMMA8491

NXP Semiconductors

DEMO BOARD FOR MMA8491

0

KIT1951MPXY8020A

KIT1951MPXY8020A

NXP Semiconductors

KIT REF DESIGN FOR TIRE SENSOR

0

D3172MMA7361LC

D3172MMA7361LC

NXP Semiconductors

BOARD XYZ-AXIS DIGITAL ACCEL D

0

FRDM-K64F-AGM02

FRDM-K64F-AGM02

NXP Semiconductors

DEMO KIT CONTAINING THE FRDM-K64

0

KIT3376MMA7360L

KIT3376MMA7360L

NXP Semiconductors

KIT EVAL 3AXIS ANLG ACCELEROMTR

0

KITSTBLITE2EVM

KITSTBLITE2EVM

NXP Semiconductors

SENSOR TOOLBX MB

0

OM11056UL

OM11056UL

NXP Semiconductors

PCA8885 AND PCF8885 EVALUATION B

0

KIT3109MMA7261QE

KIT3109MMA7261QE

NXP Semiconductors

KIT EVAL FOR 2.5 XYZ-AXIS ACCEL

0

KITMMA9555LEVM

KITMMA9555LEVM

NXP Semiconductors

3 AXIS SMART SENSOR WITH INTEGRA

0

RD3473MMA7360L

RD3473MMA7360L

NXP Semiconductors

BOARD ZSTAR2 XYZ-AXIS ACCEL

0

KIT3468MMA7456L

KIT3468MMA7456L

NXP Semiconductors

BOARD EVALUATION FOR MMA7456L

0

LFSTBEB7455

LFSTBEB7455

NXP Semiconductors

BOARD DEV ACCELEROMETER MMA7455L

0

KITFXLC95000EVM

KITFXLC95000EVM

NXP Semiconductors

BOARD EVAL FXLC95000

0

OM11057AUL

OM11057AUL

NXP Semiconductors

ADD-ONBOARD 2X8885 DIRECT SENSIN

0

KIT3376MMA7340L

KIT3376MMA7340L

NXP Semiconductors

KIT EVAL 3AXIS ANLG ACCELEROMTR

0

TWRPI-TOUCH-PAK

TWRPI-TOUCH-PAK

NXP Semiconductors

TOWER SYSTEM TOUCH PAK

0

RD3112MMA7260Q

RD3112MMA7260Q

NXP Semiconductors

BOARD DEMO STAR FOR MMA7260Q

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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