Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
BRKOUT-FXLN8371Q

BRKOUT-FXLN8371Q

NXP Semiconductors

BOARD BREAKOUT FXLN8371Q

7

FRDMKL25-A8471

FRDMKL25-A8471

NXP Semiconductors

FXLS8471Q BOARD WITH FRDM-KL25Z

1

TWRPI-MMA845XQ

TWRPI-MMA845XQ

NXP Semiconductors

TOWER SYST XTRINSIC ACCELEROMETR

2

BRKTSTBC-A8491

BRKTSTBC-A8491

NXP Semiconductors

BREAKOUT BOARD FOR MMA8491Q

3

FRDMSTBC-P3115

FRDMSTBC-P3115

NXP Semiconductors

EVAL BOARD FOR MPL3115A2

3

FRDM-STBC-AGM04

FRDM-STBC-AGM04

NXP Semiconductors

FRDM BOARD FORMMA8652/MAG311

3

OM13257,598

OM13257,598

NXP Semiconductors

UNIVERSAL TEMPERATURE SENSOR DAU

0

KIT3VSOPXBRD

KIT3VSOPXBRD

NXP Semiconductors

KIT EVALUATION 3VSOPX

0

BRKOUT-FXLN8372Q

BRKOUT-FXLN8372Q

NXP Semiconductors

BOARD BREAKOUT FXLN8372Q

0

FRDMSTBI-B3115

FRDMSTBI-B3115

NXP Semiconductors

SENSOR TOOLBOX DEVELOPMENT PLATF

0

BRKTSTBCDP5004

BRKTSTBCDP5004

NXP Semiconductors

SENSOR BREAKOUT BOARD FOR THE MP

0

FRDM-K64F-AGM04

FRDM-K64F-AGM04

NXP Semiconductors

KIT CONTAINING THE FRDM-K64F AND

0

BRKTSTBI-B3115

BRKTSTBI-B3115

NXP Semiconductors

SENSOR BREAKOUT BOARD FOR FXPQ31

0

BRKOUT-FXLN8362Q

BRKOUT-FXLN8362Q

NXP Semiconductors

BOARD BREAKOUT FXLN8362Q

0

OM40004UL

OM40004UL

NXP Semiconductors

LPC845 CAPACITIVE TOUCH DEV. KIT

0

BRKTSTBC-A8451

BRKTSTBC-A8451

NXP Semiconductors

BRKTSTBC-A8451

0

BRKOUT-FXLS8471Q

BRKOUT-FXLS8471Q

NXP Semiconductors

BOARD BREAKOUT FXLS8471Q

0

KITLOPRESSMPX12

KITLOPRESSMPX12

NXP Semiconductors

KIT EVALUATION FOR MPX12

0

FRDMKL27-B3115

FRDMKL27-B3115

NXP Semiconductors

SENSOR TOOLBOX KIT FOR THE FXPQ3

0

FRDMSTBC-A8451

FRDMSTBC-A8451

NXP Semiconductors

FREEDOM SENSOR SHIELD BOARD FOR

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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