Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
FRDM-K22F-AGM01

FRDM-K22F-AGM01

NXP Semiconductors

EVB KIT FRDM-K22F/FRDM-STBCAGM01

4

BRKT-STBC-SA9500

BRKT-STBC-SA9500

NXP Semiconductors

BREAKOUT BOARD FOR FXLC95000CL

5

KITMPR03XEVM

KITMPR03XEVM

NXP Semiconductors

KIT EVAL FOR MPR03X

0

TSSEVB

TSSEVB

NXP Semiconductors

BOARD EVALUATION TOUCH SENSING

0

BRKT-STBC-AGM01

BRKT-STBC-AGM01

NXP Semiconductors

BREAKOUT BOARD LEON2 GAUSS

1

BRKTSTBC-P3115

BRKTSTBC-P3115

NXP Semiconductors

BREAKOUT BOARD FOR MPL3115A2

1

FRDM-STBC-SA9500

FRDM-STBC-SA9500

NXP Semiconductors

EVAL BOARD FOR FXLC95000CL

0

FRDM-K64F-AGM01

FRDM-K64F-AGM01

NXP Semiconductors

EVB KIT FRDM-K64F/FRDM-STBCAGM01

113

RD-KL25-AGMP01

RD-KL25-AGMP01

NXP Semiconductors

DATA COLLECTION REFERENCE DESIGN

22

EVBCRTOUCH

EVBCRTOUCH

NXP Semiconductors

BOARD EVAL TOUCH SENSING PLTFRM

2

FRDM-FXS-MULT2-B

FRDM-FXS-MULT2-B

NXP Semiconductors

BLUETOOTH DEV PLATFORM

2

FRDM-STBC-AGM01

FRDM-STBC-AGM01

NXP Semiconductors

FREEDOM BOARD FXAS21002/FXOS8700

22

FRDMKL25-P3115

FRDMKL25-P3115

NXP Semiconductors

MPL3115A2 BOARD WITH FRDM-KL25Z

15

BRKTSTBC-A8471

BRKTSTBC-A8471

NXP Semiconductors

BREAKOUT BOARD FOR FXLS8471Q

19

FRDMSTBC-A8491

FRDMSTBC-A8491

NXP Semiconductors

EVAL BOARD FOR MMA8491Q

0

FRDMKL25-A8491

FRDMKL25-A8491

NXP Semiconductors

MMA8491Q BOARD WITH FRDM-KL25Z

9

FRDMSTBC-A8471

FRDMSTBC-A8471

NXP Semiconductors

EVAL BOARD FOR FXLS8471Q

4

FRDM-K22F-SA9500

FRDM-K22F-SA9500

NXP Semiconductors

FXLC95000CL BOARD WITH FRDM-K22F

0

TWRPITSS-SHIELD

TWRPITSS-SHIELD

NXP Semiconductors

HDWR TOWER MCU BOARD SHIELD1

0

BRKOUT-FXLN8361Q

BRKOUT-FXLN8361Q

NXP Semiconductors

BOARD BREAKOUT FXLN8361Q

4

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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