Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
PIS-0552 Pi Supply	FLICK ZERO	20
PIS-1266 Pi Supply	OCTOPUS ANALOG ROTATION BRICK-BL	47
PIS-1130 Pi Supply	MICRO:BIT LORA NODE 868/915MHZ	23
PIS-1260 Pi Supply	OCTOPUS ANALOG PHOTOCELL BRICK O	50
PIS-1348 Pi Supply	RASPBERRY PI 1 WIRE I2C HAT	9
PIS-1274 Pi Supply	OCTOPUS ANALOG NOISE SOUND SENSO	38
PIS-1357 Pi Supply	RASPBERRY PI EXPANDER ADC DAC RT	10
PIS-1569 Pi Supply	PI SUPPLY MICRO:BIT BREAKOUT BOA	49
PIS-1360 Pi Supply	RASPBERRY PI RS485 HAT	53
PIS-1128 Pi Supply	IOT LORA NODE PHAT 868MHZ/915MHZ	41
PIS-1271 Pi Supply	OCTOPUS RAIN/STEAM SENSOR	19
PIS-1127 Pi Supply	IOT LORA GATEWAY HAT - 915 MHZ	40
PIS-1268 Pi Supply	OCTOPUS HUNT SENSOR	184
PIS-1351 Pi Supply	RASPBERRY PI ADC DIFFERENTIAL HA	22
PIS-0586 Pi Supply	PIJUICE ZERO - A PORTABLE POWER	0
PIS-0250 Pi Supply	PI POE SWITCH - POWER OVER ETHER	22
PIS-1284 Pi Supply	OCTOPUS ADKEYPAD	30
PIS-1264 Pi Supply	OCTOPUS 5MM LED BRICK OBLED - WH	50
PIS-1278 Pi Supply	OCTOPUS PASSIVE BUZZER BRICK OBP	226
PIS-0264 Pi Supply	PAPIRUS MEDIUM (2.0")	25

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems