Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
PIS-1361

PIS-1361

Pi Supply

RASPBERRY PI RTC HAT

19

PIS-0262

PIS-0262

Pi Supply

PAPIRUS ZERO MULTI SCREEN

22

PIS-1690

PIS-1690

Pi Supply

RASPBERRY PI 5MP SPY CAMERA BOAR

38

PIS-1359

PIS-1359

Pi Supply

PI ZERO 16 DIGITAL I/O EXPANDER

43

PIS-0029

PIS-0029

Pi Supply

FISH DISH RASPBERRY PI LED BUZZE

0

PIS-0914

PIS-0914

Pi Supply

THUNDERBORG DUAL 5A MOTOR CONTRO

4

PIS-1595

PIS-1595

Pi Supply

RAK2013 CELL PI HAT BG96 GLOB

10

PIS-1269

PIS-1269

Pi Supply

OCTOPUS SINGLE RGB RAINBOW LED

43

PIS-1282

PIS-1282

Pi Supply

OCTOPUS SOIL MOISTURE SENSOR BRI

16

PIS-1691

PIS-1691

Pi Supply

RASPBERRY PI 5MP SPY CAMERA BOAR

41

PIS-1265

PIS-1265

Pi Supply

OCTOPUS 5MM LED BRICK OBLED - YE

50

PIS-1136

PIS-1136

Pi Supply

IOT LORA NODE SHIELD 868/915 MHZ

51

PIS-0916

PIS-0916

Pi Supply

XLOBORG 3 AXIS ACCELEROMETER & M

0

PIS-1272

PIS-1272

Pi Supply

OCTOPUS 0.36'' SEGMENT LED BRICK

41

JBM-002

JBM-002

Pi Supply

JUSTBOOM DIGI HAT

15

PIS-0266

PIS-0266

Pi Supply

PAPIRUS MULTI SCREEN

18

PIS-0790

PIS-0790

Pi Supply

PAPIRUS DISPLAY EXTENSION

17

PIS-0263

PIS-0263

Pi Supply

PAPIRUS SMALL (1.44")

20

PIS-1283

PIS-1283

Pi Supply

OCTOPUS CRASH SENSOR BRICK

33

PIS-0100

PIS-0100

Pi Supply

MOTOR CONTROLLER BOARD KIT FOR R

8

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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