Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
PIS-1352 Pi Supply	RASPBERRY PI I2C ADC HAT	24
PIS-1353 Pi Supply	ARDUINO UNO TO RASPBERRY PI ADAP	76
PIS-1285 Pi Supply	OCTOPUS PIR SENSOR BRICK	44
PIS-1358 Pi Supply	RASPBERRY PI 32 DIGITAL I/O EXPA	25
JBM-003 Pi Supply	JUSTBOOM AMP HAT	0
JBM-001 Pi Supply	JUSTBOOM DAC HAT	35
PIS-0062 Pi Supply	GERT VGA 666 KIT - HARDWARE VGA	0
PIS-1350 Pi Supply	PI ZERO ADC-DAC HAT	7
PIS-0702 Pi Supply	RYANTECK RTK.GPIO	33
PIS-1570 Pi Supply	PI SUPPLY BIT:BUGGY MAIN BOARD	50
PIS-1261 Pi Supply	OCTOPUS MOTOR BRICK	44
PIS-1267 Pi Supply	1 CHANNEL RELAY 3V RELAY MODULE	129
PIS-0212 Pi Supply	PIJUICE - A PORTABLE POWER PLATF	27
PIS-1279 Pi Supply	OCTOPUS 5MM LED BRICK - GREEN	50
PIS-1277 Pi Supply	OCTOPUS OLED DISPLAY	33
PIS-0400 Pi Supply	WISNODE LORA ARDUINO SHLD 923MHZ	0
PIS-1362 Pi Supply	RASPBERRY PI SERIAL PLUS RS232 H	45
PIS-1273 Pi Supply	OCTOPUS BME280 PRESSURE SENSOR	29
PIS-0554 Pi Supply	FLICK LARGE	7
PIS-0929 Pi Supply	TRIBORG PLUS RASPBERRY PI 40 PIN	9

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems