Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
PIS-1280

PIS-1280

Pi Supply

OCTOPUS 5MM LED BRICK OBLED - BL

15

PIS-1568

PIS-1568

Pi Supply

PI SUPPLY MICRO:BIT BREADBOARD A

47

PIS-1263

PIS-1263

Pi Supply

OCTOPUS TEMPERATURE SENSOR BRICK

172

JBM-004

JBM-004

Pi Supply

JUSTBOOM DAC ZERO

0

PIS-0573

PIS-0573

Pi Supply

MEDIA CENTER HAT FOR RASPBERRY P

48

PIS-1276

PIS-1276

Pi Supply

OCTOPUS DIGITAL PUSH BUTTON BRIC

31

JBM-006

JBM-006

Pi Supply

JUSTBOOM AMP ZERO

0

PIS-1262

PIS-1262

Pi Supply

OCTOPUS 5MM LED BRICK OBLED - RE

50

JBM-005

JBM-005

Pi Supply

JUSTBOOM DIGI ZERO

17

PIS-1281

PIS-1281

Pi Supply

OCTOPUS ANALOG ROTATION BRICK OB

48

PIS-0918

PIS-0918

Pi Supply

PICOBORG QUAD MOTOR CONTROLLER W

0

PIS-0244

PIS-0244

Pi Supply

GPIO ADAPTER FOR RPI-DISPLAY B+

95

PIS-1426

PIS-1426

Pi Supply

ANAVI INFRARED PHAT FOR RASPBERR

31

PIS-1428

PIS-1428

Pi Supply

ANAVI LIGHT PHAT

7

PIS-0920

PIS-0920

Pi Supply

ZEROBORG BASIC QUAD MOTOR CONTRO

0

PIS-0927

PIS-0927

Pi Supply

BATTBORG PI BATTERY POWER BOARD

0

PIS-1363

PIS-1363

Pi Supply

PI ZERO RS232 SERIAL HAT

0

PIS-0923

PIS-0923

Pi Supply

ZEROBORG TRIPLE STACK 9V UNSOLDE

0

PIS-0265

PIS-0265

Pi Supply

PAPIRUS LARGE (2.7")

15

PIS-0260

PIS-0260

Pi Supply

PAPIRUS ZERO SMALL (1.44")

24

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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