Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
VIP-M07-ADIS STMicroelectronics	AUDIO & BODY	1
STEVAL-IOD003V1 STMicroelectronics	STEVAL-IOD003V1	3
X-NUCLEO-IKS02A1 STMicroelectronics	X-NUCLEO-IKS02A1	0
X-NUCLEO-S2868A2 STMicroelectronics	SUB-1 GHZ 868 MHZ RF EXPANSION S	82
X-NUCLEO-IHM14A1 STMicroelectronics	NUCLEO BOARD STSPIN820 DRIVER	14
X-NUCLEO-IDS01A4 STMicroelectronics	NUCLEO BOARD SPSGRF-868 MODULE	7
X-NUCLEO-LED16A1 STMicroelectronics	NUCLEO BOARD LED1642GW LED DRVR	7
X-NUCLEO-53L1A2 STMicroelectronics	VL53L1CB NUCLEO EXPANSION BOARD	0
X-NUCLEO-SAFEA1A STMicroelectronics	NUCLEO BOARD STSAFE-A110 SECURE	59
X-NUCLEO-IHM02A1 STMicroelectronics	NUCLEO BOARD L6470 MOTOR DRIVER	68
X-NUCLEO-OUT01A1 STMicroelectronics	NUCLEO BOARD ISO8200BQ DRIVER	0
X-NUCLEO-S2915A1 STMicroelectronics	SUB-1 GHZ 915 MHZ RF EXPANSION B	39
STEVAL-STWINMAV1 STMicroelectronics	ANALOG MICROPHONE ARRAY EXPANSIO	26
L99LD21-ADIS STMicroelectronics	LED DRIVER DISCOVERY	2
X-NUCLEO-SNK1M1 STMicroelectronics	STM32 NUCLEO EXPANSION BOARDS	0
X-NUCLEO-S2868A1 STMicroelectronics	SUB-1 GHZ 868 MHZ RF EXPANSION B	0
X-NUCLEO-IDW04A1 STMicroelectronics	WI-FI EXPANSION BOARD BASED ON S	0
X-NUCLEO-IDB04A1 STMicroelectronics	NUCLEO BOARD BLUENRG BLE	0
X-NUCLEO-IKS01A1 STMicroelectronics	NUCLEO BOARD MEMS/ENVIRO SENSOR	0
X-NUCLEO-EEPRMA1 STMicroelectronics	STANDARD I2C AND SPI EEPROM	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems