Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
X-NUCLEO-EEPRMA2 STMicroelectronics	STANDARD IC AND SPI EEPROM MEMOR	21
X-NUCLEO-53L1A1 STMicroelectronics	NUCLEO BOARD VL53L1X SENSOR	38
X-NUCLEO-IHM16M1 STMicroelectronics	THREE-PHASE BRUSHLESS DC MOTOR D	23
X-NUCLEO-IHM17M1 STMicroelectronics	NUCLEO BRD STSPIN233 MOTOR DRVR	2
B-F446E-96B01A STMicroelectronics	SENSOR BOARD WITH STM32F446VET6	3
X-NUCLEO-IKS01A2 STMicroelectronics	NUCLEO BOARD MEMS/ENVIRO SENSOR	349
X-NUCLEO-IHM01A1 STMicroelectronics	NUCLEO BOARD L6474 MOTOR DRIVER	44
X-NUCLEO-GFX01M1 STMicroelectronics	EXPANSION BOARD ADDS GRAPHIC USE	46
AEK-CON-SENSOR1 STMicroelectronics	CONNECTOR BOARD FOR SPC5 MCU DIS	20
X-NUCLEO-IHM07M1 STMicroelectronics	NUCLEO BOARD L6230 MOTOR DRIVER	15
X-NUCLEO-NFC05A1 STMicroelectronics	NUCLEO BOARD	106
X-NUCLEO-LED61A1 STMicroelectronics	NUCLEO BOARD LED6001 LED DRIVER	0
X-NUCLEO-AMICAM1 STMicroelectronics	NUCLEO BOARD MP23ABS1 MICROPHONE	11
X-NUCLEO-CCA01M1 STMicroelectronics	NUCLEO BOARD STA350BW AUDIO	10
X-NUCLEO-IHM08M1 STMicroelectronics	NUCLEO BOARD STL220N6F7 DRIVER	0
X-NUCLEO-CCA02M2 STMicroelectronics	STM32 NUCLEO EXPANSION BOARDS	80
X-NUCLEO-53L3A2 STMicroelectronics	PROXIMITY TOF SENSOR EXPANSION B	50
STEVAL-MKI214V1 STMicroelectronics	STEVAL-MKI214V1 LPS33KTR ADAPTER	25
X-NUCLEO-NFC06A1 STMicroelectronics	NFC CARD READER EXPANSION BOARD	0
X-NUCLEO-BNRG2A1 STMicroelectronics	NUCLEO BOARD BLUENRG-M2SP BLE	62

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems