Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
STEVAL-MKI217V1 STMicroelectronics	12 V - 5 W ISOLATED FLYBACK CONV	21
X-NUCLEO-53L0A1 STMicroelectronics	NUCLEO BOARD VL53L0X SENSOR	22
X-NUCLEO-IHM11M1 STMicroelectronics	NUCLEO BRD STSPIN230 MOTOR DRVR	1
X-NUCLEO-PLM01A1 STMicroelectronics	POWER LINE COMMUNICATION	22
X-NUCLEO-PLC01A1 STMicroelectronics	NUCLEO BOARD PLC GPIO	1
STEVAL-IOM001V1 STMicroelectronics	STEVAL-IOM001V1	3
X-NUCLEO-STMODA1 STMicroelectronics	NUCLEO BOARD STMOD+ EXPANSION	9
X-NUCLEO-NFC04A1 STMicroelectronics	BOARD & REF DESIGN	88
X-NUCLEO-IHM12A1 STMicroelectronics	NUCLEO BOARD STSPIN240 DRIVER	14
X-NUCLEO-IDW01M1 STMicroelectronics	NUCLEO BOARD SPWF01SA MODULE	27
X-NUCLEO-IDS01A5 STMicroelectronics	NUCLEO BOARD SPSGRF-915 MODULE	13
X-NUCLEO-IHM09M1 STMicroelectronics	NUCLEO BRD ST MOTOR CONTROL CONN	0
X-NUCLEO-IHM03A1 STMicroelectronics	NUCLEO BOARD LPOWERSTEP01 DRIVER	0
STEVAL-STWINWFV1 STMicroelectronics	WI-FI EXPANSION FOR THE SENSORTI	28
X-NUCLEO-IHM06A1 STMicroelectronics	NUCLEO BRD STSPIN220 MOTOR DRVR	77
X-NUCLEO-IKA01A1 STMicroelectronics	NUCLEO BRD TSU104 TSV734 TSZ124	4
X-NUCLEO-NFC01A1 STMicroelectronics	NUCLEO BOARD M24SR64-Y NFC	9
I-NUCLEO-LRWAN1 STMicroelectronics	OW-POWER WIRELESS NUCLEO	0
STEVAL-MKI215V1 STMicroelectronics	STEVAL-MKI215V1 LSM6DSO32TR ADAP	14
X-NUCLEO-IHM05A1 STMicroelectronics	NUCLEO BOARD L6208 MOTOR DRIVER	21

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems