Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
X-NUCLEO-NFC02A1 STMicroelectronics	NUCLEO BOARD M24LR04E-R NFC	14
X-NUCLEO-6180A1 STMicroelectronics	PROXIMITY TOF SENSOR EXPANSION B	32
X-NUCLEO-OUT10A1 STMicroelectronics	INDUSTRIAL DIGITAL OUTPUT EXPANS	20
STEVAL-MKI218V1 STMicroelectronics	STEVAL-MKI218V1	39
X-NUCLEO-IHM04A1 STMicroelectronics	NUCLEO BOARD L6206 MOTOR DRIVER	65
X-NUCLEO-NFC03A1 STMicroelectronics	NUCLEO BOARD CR95HF NFC	32
STEVAL-MKI220V1 STMicroelectronics	LPS27HHTW ADAPTER BOARD FOR A ST	30
X-NUCLEO-USBPDM1 STMicroelectronics	NUCLEO TYPE-C PWR DELIVERY SINK	18
X-NUCLEO-IHM13A1 STMicroelectronics	NUCLEO BRD STSPIN250 MOTOR DRVR	18
X-NUCLEO-IKS01A3 STMicroelectronics	X-NUCLEO-IKS01A3	250
STEVAL-IDI009V1 STMicroelectronics	EVAL BOARD PIR SENSOR	13
X-NUCLEO-6180XA1 STMicroelectronics	NUCLEO BOARD VL6180X SENSOR	18
STEVAL-MKI219V1 STMicroelectronics	LPS22CH ADAPTER BOARD FOR A STAN	30
B-CAMS-OMV STMicroelectronics	FLEXIBLE CAMERA ADAPTER BOARD	0
X-NUCLEO-OUT08A1 STMicroelectronics	INDUSTRIAL DIGITAL OUTPUT EXPANS	18
X-NUCLEO-IPS02A1 STMicroelectronics	24V INTELLIGENT POWER SWITCH EXP	18
B-LCD40-DSI1 STMicroelectronics	4-INCH WVGA TFT LCD BOARD WITH M	49
X-NUCLEO-OUT02A1 STMicroelectronics	INDUSTRIAL DIGITAL OUTPUT EXPANS	16
X-NUCLEO-IHM15A1 STMicroelectronics	DUAL BRUSH DC MOTOR DRIVER EXPAN	22
X-NUCLEO-LPM01A STMicroelectronics	STM32 NUCLEO EXPANSION BOARD POW	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems