Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
MIKROE-2086

MIKROE-2086

MikroElektronika

IR GESTURE CLICK

4

MIKROE-3328

MIKROE-3328

MikroElektronika

ALTITUDE 3 CLICK

14

ASD2413-R-LR

ASD2413-R-LR

TinyCircuits

TINYSHIELDMATRIXLEDS RED

0

BOOSTXL-POSMGR

BOOSTXL-POSMGR

Texas Instruments

DEVELOPMENT SPECIALIZED

13

DEV-09729

DEV-09729

SparkFun

PROTOSCREWSHIELD

19

AST1020

AST1020

TinyCircuits

ROTARY SWITCH WIRELING

20

4366

4366

Adafruit

STEMMA QT / QWIIC TLV493D 3AXIS

52

DEV-10587

DEV-10587

SparkFun

MUSIC INSTRUMENT SHIELD

3

5649

5649

Kitronik

MI:SOUND SPEAKER BOARD FOR BBC M

0

KIT-5620

KIT-5620

Pimoroni

MOTOR DRIVER BOARD V2 FOR THE BB

0

MIKROE-3045

MIKROE-3045

MikroElektronika

IBUTTON CLICK

0

106030000

106030000

Seeed

ENERGY SHIELD

1

ISMART43362-E

ISMART43362-E

Inventek Systems

WI-FI ARDUINO SHIELD -802.11 B/G

4

MIKROE-4199

MIKROE-4199

MikroElektronika

UWB CLICK

19

1SHEELD

1SHEELD

Pimoroni

1SHEELD+ FOR SMARTPHONE

0

MIKROE-2405

MIKROE-2405

MikroElektronika

SKYWIRE CLICK

4

SPX-16394

SPX-16394

SparkFun

QWIIC IRIDIUM 9603N

0

MIKROE-4107

MIKROE-4107

MikroElektronika

CAN FD 4 CLICK

12

MIKROE-2453

MIKROE-2453

MikroElektronika

LCD MINI CLICK

64

2029B

2029B

Adafruit

ASSEMBLED PI COBBLER

67

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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