Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
SPX-17072 SparkFun	QWIIC MULTI DISTANCE SENSOR - VL	0
MIKROE-3912 MikroElektronika	RS232 SPI CLICK	4
206-0002-01 SchmartBoard	THROUGH HOLE PROTOTYPING SHIELD	31
MIKROE-3449 MikroElektronika	GYRO 3 CLICK	4
DPP401A000 TE Connectivity Measurement Specialties	XPLAINED PRO KMA36 (R)	5
PROCPE-BBBCAPE GHI Electronics, LLC	BEAGLEBONE PROTO CAPE	61
MIKROE-3863 MikroElektronika	RS485 ISOLATOR 2 CLICK	32
X-NUCLEO-IHM15A1 STMicroelectronics	DUAL BRUSH DC MOTOR DRIVER EXPAN	22
MIKROE-4331 MikroElektronika	ISO 9141 CLICK	4
ASD2501-R TinyCircuits	TINYSHIELDGPS	1
X-NUCLEO-LPM01A STMicroelectronics	STM32 NUCLEO EXPANSION BOARD POW	0
PIR-01 OSEPP Electronics	PASSIVE INFRARED PIR SENSOR MOD	624
3243 Adafruit	ASSEMBLED DC MOTOR + STEPPER FEA	48
AST1035 TinyCircuits	BUZZER WIRELING	30
DEV-17512 SparkFun	SPARKFUN QWIIC PHAT EXTENSION FO	39
4485 Adafruit	9 DOF IMU W/ ACCEL/GYRO/MAG	0
3813 Adafruit	ANIMATED EYES BONNET RASPBERRYPI	78
3625 Adafruit	1.54" TRI-COLOR EINK / EPAPER DI	15
MIKROE-3471 MikroElektronika	KEYLOCK 2 CLICK	5
DFR0382 DFRobot	7 SEGMENT LED KEYPAD SHIELD FOR	14

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems