Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
111020103 Seeed	GROVE - DUAL BUTTON	10
EVAL-ADXL362-ARDZ Analog Devices, Inc.	EVAL BOARD FOR ADXL362	3
DPP902S000 TE Connectivity Measurement Specialties	ARDUINO WEATHER SHIELD	611
5636 Kitronik	KLIMATE BOARD FOR THE BBC MICRO:	41
MIKROE-4073 MikroElektronika	6DOF IMU 12 CLICK	15
MIKROE-3662 MikroElektronika	THERMO 16 CLICK	5
PIM035 Pimoroni	FLOTILLA DIAL W/ LEDS	13
MIKROE-4046 MikroElektronika	FORCE 2 CLICK	3
PIM268 Pimoroni	SCROLL PHAT HD	23
MOD-MPU9150 Olimex	UEXT BOARD MPU9150 9-AXIS MOTION	0
DFR0472 DFRobot	32X32 RGB LED MATRIX PANEL (4MM	2
MIKROE-4456 MikroElektronika	GNSS RTK CLICK	0
PIM480 Pimoroni	SGP30 AIR QUALITY SENSOR BREAKOU	0
MIKROE-2887 MikroElektronika	MIC33153 CLICK	0
GPS-15712 SparkFun	GPS BREAKOUT NEO-M9N QWIIC U.FL	110
EV6550DHAT CML Microcircuits	VOICE CODEC PI HAT FOR CMX655D	7
MIKROE-2546 MikroElektronika	INTEL JOULE CLICK SHIELD	0
PIS-1351 Pi Supply	RASPBERRY PI ADC DIFFERENTIAL HA	22
410-241 Digilent, Inc.	PMODDA3 SINGLE 16-BIT DAC MODULE	3
MIKROE-1640 MikroElektronika	BEYOND KEYS CLICK PACK	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems