Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
U090 M5Stack	BAROMETRIC PRESSURE UNITBMP280	0
ASX00005 Genuino (Arduino)	ARDUINO MKR CAN SHIELD	16
MIKROE-990 MikroElektronika	BOARD ACCY LIGHTHZ CLICK	0
MIKROE-1529 MikroElektronika	MIKROMEDIA 5 FOR TIVA SHIELD	0
MIKROE-4207 MikroElektronika	I2C EXTEND CLICK	3
EXP-C-24 RLE Technologies	FMS EXPANSION CARD C 24 DI 24VDC	100
PIS-0586 Pi Supply	PIJUICE ZERO - A PORTABLE POWER	0
MIKROE-3690 MikroElektronika	COLOR 9 CLICK	8
MIKROE-4204 MikroElektronika	MAGNETO 8 CLICK	4
SEN0240 DFRobot	GRAVITY ANALOG EMG SENSOR BY OYM	4
410-356 Digilent, Inc.	DMM SHIELD	12
410-345 Digilent, Inc.	PMOD VGA: VIDEO GRAPHICS ARRAY	40
MIKROE-3685 MikroElektronika	REMOTE TEMP CLICK	4
SEN0193 DFRobot	GRAVITY: ANALOG CAPACITIVE SOIL	36
NHD-4.3CTP-SHIELD-V Newhaven Display, Intl.	LCD 4.3" 480X272 CAP TOUCHSCREEN	41
MIKROE-2380 MikroElektronika	ROTARY O CLICK	2
4816 Adafruit	ADAFRUIT BMP390 - PRECISION BARO	0
X-NUCLEO-EEPRMA2 STMicroelectronics	STANDARD IC AND SPI EEPROM MEMOR	21
ATWINC3400-XSTK Roving Networks / Microchip Technology	WILC3400 XPLAINED PRO STARTER KI	5
MIKROE-2670 MikroElektronika	GNSS 5 CLICK	63

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems