Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	AT768EAT-8IN-ITOFILM Roving Networks / Microchip Technology	8 ITO FILM FOR MXT768EAT	0
	DVA16XP640 Roving Networks / Microchip Technology	ADAPTER DEVICE FOR MPLAB-ICE	0
	ACICE0302 Roving Networks / Microchip Technology	14P SOIC HEADER TRANSITION	0
	AT540EAT-7IN-ITOFILM Roving Networks / Microchip Technology	7 ITO FILM FOR MXT540EAT	0
	PCM18XA0 Roving Networks / Microchip Technology	PROCESSOR MODULE PIC18CXX2	0
	PCM18XH3 Roving Networks / Microchip Technology	PROCESSOR MODULE PIC18F242,4320	0
	ATSTK600-ATMEGA2560 Roving Networks / Microchip Technology	STK600 DEVICECARD ATMEGA2560	0
	AT88CK109BK8 Roving Networks / Microchip Technology	BOARD KIT CRYPTO W/2 SOIC SKTS	0
	AC163003 Roving Networks / Microchip Technology	BOARD DEMO DELTA SIGMA ADC MSC1	0
	XLT08SO Roving Networks / Microchip Technology	SOCKET TRANSITION ICE 8SOIC	0
	BK0015 Roving Networks / Microchip Technology	BOOK BEGINNER GUIDE PROGR PIC32	0
	AC163004 Roving Networks / Microchip Technology	BOARD DEMO FLOW RATE SENSOR MSC1	0
	XLT20SO1 Roving Networks / Microchip Technology	SOCKET TRANSITION ICE 20SOIC	0
	XLT64PT2 Roving Networks / Microchip Technology	SKT TRAN ICE17C75X/18C6X8 64TQFP	0
	AVRONE-PSU Roving Networks / Microchip Technology	AVRONE REPLACEMENT PWR STANDBY	0
	PMF18WB1 Roving Networks / Microchip Technology	MODULE PROCESSOR ICE4000	0
	PS051 Roving Networks / Microchip Technology	BOARD POWER INFO FOR PS70X	0
	PCM18XS0 Roving Networks / Microchip Technology	PROCESSOR MODULE MPLAB ICE2000	0
	MA300013 Roving Networks / Microchip Technology	MODULE DSPIC30F SAMPLE 80QFP	0
	DAF18-4 Roving Networks / Microchip Technology	DEVICE ADAPTER FOR ICE4000	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization