Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	PMF18WA2 Roving Networks / Microchip Technology	PROCESSOR MODULE ICE4000	0
	XLT28QFN2 Roving Networks / Microchip Technology	SOCKET TRAN ICE 28QFN/18DIP	0
	PCM16XN1 Roving Networks / Microchip Technology	PROCESSOR MOD PIC16C717/770/771	0
	AT43DK380-PDC1 Roving Networks / Microchip Technology	CARD DAUGHTER 32BIT ARM7	0
	PCM18XR0 Roving Networks / Microchip Technology	MODULE PROCESSOR FOR MPLABICE	0
	DVA16XP186 Roving Networks / Microchip Technology	ADAPTER PIC16F818/819	0
	PMF18WC0 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR ICE4000	0
	AT91MEC01 Roving Networks / Microchip Technology	AT91 MEMORY EXTENSION CARD	0
	AT336SAT-7IN-TSCREEN Roving Networks / Microchip Technology	7 GLASS TOUCHSCREEN FOR MXT336S	0
	XLT80PT Roving Networks / Microchip Technology	SOCKET TRANSITION ICE 80TQFP	0
	ATDH2081 Roving Networks / Microchip Technology	EXTRA DWNLD CABLE ATDH2080 PROBD	0
	PCM16XN0 Roving Networks / Microchip Technology	PROCESSOR MOD PIC16C717 770 771	0
	MA330025-2 Roving Networks / Microchip Technology	MOD PIM DSPIC33EP512MU814 GRAPH	0
	XLT08DFN Roving Networks / Microchip Technology	SOCKET TRANSITION ICE 8DFN	0
	XLT64PT3 Roving Networks / Microchip Technology	SOCKET TRANSITION ICE 64TQFP	0
	MA240025-2 Roving Networks / Microchip Technology	MOD PIM PIC24EP512GU814 GRAPH	0
	ACICE0307 Roving Networks / Microchip Technology	28P SSOP HEADER TRANSITION	0
	PCM18XS1 Roving Networks / Microchip Technology	MODULE PROC FOR PIC18F8722/8627	0
	AC163001 Roving Networks / Microchip Technology	BOARD DEMO VOLTAGE BOOST MSC1	0
	XLT14SO Roving Networks / Microchip Technology	SOCKET TRANSITION ICE 14SOIC	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization