Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	ATDH1150VPC- Roving Networks / Microchip Technology	BOARD PROGRAM ISP 3/5V SUPPORT	0
	PCM18XK0 Roving Networks / Microchip Technology	MODULE PROCESSOR PIC18FXXXX	0
	XLT28QFN Roving Networks / Microchip Technology	SOCKET TRANSITION ICE 28QFN	0
	DVA16XP187 Roving Networks / Microchip Technology	ADAPTER FOR PIC16F716 18DIP	0
	ATICE10UPGR Roving Networks / Microchip Technology	KIT UPGRADE ICEPRO TO ICE10	0
	AC163002 Roving Networks / Microchip Technology	BOARD DEMO HI-PWR IR DRIVER MSC1	0
	AT64PSKT-TOP Roving Networks / Microchip Technology	TOP SOCKET FOR MEGAICE 64-TQFP	0
	ATADAPMEGA169 Roving Networks / Microchip Technology	ADAPTER PERSON ICE50 ATMEGA169	0
	PS0019 Roving Networks / Microchip Technology	DEV TOOL PWR SUPPLY PICDEM	0
	AT64PSKT-BOT Roving Networks / Microchip Technology	BASE SOCKET FOR MEGAICE 64-TQFP	0
	ATICE40UPGR Roving Networks / Microchip Technology	KIT UPGRADE MEGA8515/8535 TINY13	0
	PCM16XP0 Roving Networks / Microchip Technology	PROCESSOR MODULE PIC16F627 628	0
	PCM16XR0 Roving Networks / Microchip Technology	PROCESSOR MODULE 16F870/871 PM	0
	PS042 Roving Networks / Microchip Technology	BOARD PWR CALIBRATION FOR PS401	0
	XLT14SS Roving Networks / Microchip Technology	SOCKET TRANSITION ICE 14TSSOP	0
	ATF15XX-SAJ44 Roving Networks / Microchip Technology	ADAPTER FOR ATF15XX-DK2 44PLCC	0
	BK0014 Roving Networks / Microchip Technology	BOOK EMBEDDED DESIGN SPANISH	0
	AC244007 Roving Networks / Microchip Technology	MPLAB REAL ICE JTAG ADAPTER	0
	PCM17XA0 Roving Networks / Microchip Technology	PROCESSOR MODULE 17C4X,75X,76X	0
	ATSTK1006 Roving Networks / Microchip Technology	KIT UPGRADE AVR32 AP7000 STK1000	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization