Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	ATUSBA-TO-MINIB Roving Networks / Microchip Technology	CBL USB A-MNI B	0
	TDGL020 Roving Networks / Microchip Technology	KIT CHIPKIT MOTOR SHIELD	0
	PCM16XE1 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR MPLAB-ICE	0
	PMF18WD1 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR ICE4000	0
	TCAD001 Roving Networks / Microchip Technology	DEV BOARD PLUS MICROSTICK	0
	TREV-MCP035 Roving Networks / Microchip Technology	PICAXE MICROBOT EXPANSION KIT	0
	AT224EAT-5.7IN-TSCRN Roving Networks / Microchip Technology	5.7 GLASS TOUCHSCREEN FOR MXT22	0
	ATF15XX-SAQ160 Roving Networks / Microchip Technology	ADAPTER FOR ATF15XX-DK2 160QFP	0
	ATAVRSMD Roving Networks / Microchip Technology	ADAPTER KIT SMD ICE200	0
	PCM18XJ0 Roving Networks / Microchip Technology	MODULE PROCESSOR ICE 2000	0
	BK0012 Roving Networks / Microchip Technology	DATA BEGIN PROGR PIC24/DSPIC33	0
	ACICE0304 Roving Networks / Microchip Technology	HEADER TRANSITION 20PSSOP	0
	BK0011 Roving Networks / Microchip Technology	LITERATURE MPLAB PROGRAMMING	0
	XLT44L1 Roving Networks / Microchip Technology	SOCKET TRAN ICE 44PLCC	0
	PCM18XN0 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR ICE2000	0
	DVA1002 Roving Networks / Microchip Technology	DEVICE ADAPTER 8/14-PIN DIP	0
	AT77SM0101BCB02VKE Roving Networks / Microchip Technology	MODULE FINGERCHIP	0
	XLT44QFN Roving Networks / Microchip Technology	SOCKET TRAN ICE 44QFN/40DIP	0
	DAF18-2 Roving Networks / Microchip Technology	DEVICE ADAPTER FOR ICE4000	0
	MA300012 Roving Networks / Microchip Technology	MODULE DSPIC30F SAMPLE 64QFP	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization