Accessories

Image Part Number Description / PDF Quantity Rfq
CY3250-64355QFN

CY3250-64355QFN

Cypress Semiconductor

KIT EMULATION PSOC CY8C64355 QFN

0

CY3210-21X34

CY3210-21X34

Cypress Semiconductor

EVALUATION POD FOR CY8C21X34

0

CY3250-48SSOP-FK

CY3250-48SSOP-FK

Cypress Semiconductor

PSOC POD FEET FOR 48-SSOP

0

CY3210-24X94

CY3210-24X94

Cypress Semiconductor

EVALUATION POD FOR CY8C24X94

0

CY3250-29XXX

CY3250-29XXX

Cypress Semiconductor

KIT ICE POD FOR CY8C29 DIP

0

CY3250-20SSOP-FK

CY3250-20SSOP-FK

Cypress Semiconductor

PSOC POD FEET FOR 20-SSOP

0

CY3280-BBM

CY3280-BBM

Cypress Semiconductor

MODULE BREADBOARD CAPSENSE

0

CY3250-20SOIC-FK

CY3250-20SOIC-FK

Cypress Semiconductor

PSOC POD FEET FOR 20-SOIC

0

CY3250-60455QFN

CY3250-60455QFN

Cypress Semiconductor

KIT EMULATION PSOC CY8C60455 QFN

0

CY3250-20334QFN

CY3250-20334QFN

Cypress Semiconductor

KIT ICE POD FOR CY8C20334 QFN

0

CY3250-8PDIP-FK

CY3250-8PDIP-FK

Cypress Semiconductor

PSOC POD FEET FOR 8-DIP

0

CY3250-27XXX

CY3250-27XXX

Cypress Semiconductor

KIT ICE POD FOR CY8C27 DIP

0

CY3230-44TQFP-AK

CY3230-44TQFP-AK

Cypress Semiconductor

KIT FOOT FOR 44-TQFP

0

CY3230-28SSOP-AK

CY3230-28SSOP-AK

Cypress Semiconductor

KIT FOOT FOR 28-SSOP

0

CY3250-8SOIC-FK

CY3250-8SOIC-FK

Cypress Semiconductor

PSOC POD FEET FOR 8-SOIC

0

CY3250-22345-POD

CY3250-22345-POD

Cypress Semiconductor

ICE POD EMULATION 28SOIC

0

CY3210-FANMOD

CY3210-FANMOD

Cypress Semiconductor

KIT PSOC FAN MODULES

0

CY3250-64315QFN

CY3250-64315QFN

Cypress Semiconductor

KIT EMULATION PSOC CY8C64315 QFN

0

S6SATU01A00SU1101

S6SATU01A00SU1101

Cypress Semiconductor

COMM TOOL S6SAP412A/S6SAP413A

0

CY3250-20434QFN

CY3250-20434QFN

Cypress Semiconductor

KIT ICE POD FOR CY8C20434 QFN

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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