Accessories

Image Part Number Description / PDF Quantity Rfq
CY3230-100TQFP-AK

CY3230-100TQFP-AK

Cypress Semiconductor

KIT FOOT FOR 100-TQFP

0

CY3203-022

CY3203-022

Cypress Semiconductor

PSOC EMU POD FT 20-DIP 1=2PCS

0

CY3250-27XXXQFN

CY3250-27XXXQFN

Cypress Semiconductor

KIT ICE POD FOR CY8C27

0

CY3230-16SOIC-AK

CY3230-16SOIC-AK

Cypress Semiconductor

KIT FOOT FOR 16-SOIC

0

CY3250-20PDIP-FK

CY3250-20PDIP-FK

Cypress Semiconductor

PSOC POD FEET FOR 20-DIP

0

CY3208-040

CY3208-040

Cypress Semiconductor

PSOC EMU POD FEET FOR 8-SOIC

0

CY3250-21X23-POD

CY3250-21X23-POD

Cypress Semiconductor

PSOC POD FOR CY8C21X23

0

CY3250-286XXQFN-POD

CY3250-286XXQFN-POD

Cypress Semiconductor

KIT REPL PODS CY8C286XXXQFN

0

CY3230-28SOIC-AK

CY3230-28SOIC-AK

Cypress Semiconductor

KIT FOOT FOR 28-SOIC

0

CY3230-8SOIC-AK

CY3230-8SOIC-AK

Cypress Semiconductor

KIT FOOT FOR 8-SOIC

0

CYUSB3ACC-001

CYUSB3ACC-001

Cypress Semiconductor

APTINA TO EZ-USB FX3 BOARD

0

CY3205-S4

CY3205-S4

Cypress Semiconductor

PSOC PROGRAM BOARD MCU 48-SSOP

0

CY3201-09

CY3201-09

Cypress Semiconductor

MCU EMULATOR POD FOR 48-SSOP

0

CY3250-22345

CY3250-22345

Cypress Semiconductor

KIT DEV ICE DEBUG FOR PSOC

0

CY3230-20SSOP-AK

CY3230-20SSOP-AK

Cypress Semiconductor

KIT FOOT FOR 20-SSOP

0

CY3250-21X23

CY3250-21X23

Cypress Semiconductor

KIT ICE POD FOR CY8C21X23 SSOP

0

CY3201-01

CY3201-01

Cypress Semiconductor

MCU EMULATOR POD FOR 8-DIP

0

CY3206-PVI

CY3206-PVI

Cypress Semiconductor

MCU PSOC EMU POD FOR ALL SSOP PK

0

CY3250-48QFN-FK

CY3250-48QFN-FK

Cypress Semiconductor

PSOC POD FEET FOR 48-QFN

0

CY3207-070

CY3207-070

Cypress Semiconductor

PSOC EMU POD FEET FOR 28-SOIC

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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