| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Cypress Semiconductor |
PSOC EMU POD FEET FOR 44-TQFP |
0 |
|
 |
Cypress Semiconductor |
KIT PSOC PROTO&DEV EXPANSION BD |
0 |
|
 |
Cypress Semiconductor |
PSOC POD FOR CY8C21X34 |
0 |
|
 |
Cypress Semiconductor |
KIT FOOT FOR 32-MLF |
0 |
|
 |
Cypress Semiconductor |
KIT ICE POD FOR CY8C24X23 |
0 |
|
 |
Cypress Semiconductor |
PSOC EMU POD FEET FOR 48-SSOP |
0 |
|
 |
Cypress Semiconductor |
PSOC POD FEET FOR 28-DIP |
0 |
|
 |
Cypress Semiconductor |
KIT REPL PODS CY3250-64355QFN |
0 |
|
 |
Cypress Semiconductor |
APTINA TO EZ-USB FX3 BOARD |
0 |
|
 |
Cypress Semiconductor |
MCU EMULATOR POD FOR 20-SOIC |
0 |
|
 |
Cypress Semiconductor |
KIT REPL PODS CY3250-24X33 |
0 |
|
 |
Cypress Semiconductor |
KIT FOOT FOR 56-MLF |
0 |
|
 |
Cypress Semiconductor |
KIT DEV PROC MODULE PSOC 4200 |
0 |
|
 |
Cypress Semiconductor |
MCU PSOC EMU POD FOR 20,28 SOIC |
0 |
|
 |
Cypress Semiconductor |
PSOC EMU POD FEET FOR 28-SSOP |
0 |
|
 |
Cypress Semiconductor |
KIT DEV ICE DEBUG FOR PSOC |
0 |
|
 |
Cypress Semiconductor |
KIT DEV CAN/LIN EXPANSION BOARD |
0 |
|
 |
Cypress Semiconductor |
KIT EMULATION ICE POD NON-QFN |
0 |
|
 |
Cypress Semiconductor |
KIT FOOT FOR 48-QFN |
0 |
|
 |
Cypress Semiconductor |
KIT FLEX POD FOR CY8C21X 32-QFN |
0 |
|
Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.
| Type | Functional Features | Application Examples |
|---|---|---|
| Interface Cables | High-speed data transfer, hot-plugging support | USB-UART converters, HDMI breakout cables |
| Power Modules | Regulated voltage output, battery management | Lipo battery packs, DC-DC converters |
| Sensor Modules | Digital/analog signal acquisition, calibration-free | Temperature/humidity sensors, IMUs |
| Expansion Boards | Peripheral interface extension, protocol conversion | Motor drivers, LoRaWAN shields |
| Debugging Tools | Real-time tracing, voltage measurement | JTAG probes, logic analyzers |
Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads
| Parameter | Description |
|---|---|
| Interface Compatibility | Supports USB 3.0, SPI up to 10MHz, I2C 400kHz |
| Power Handling | 1.8V-24V input range, 5A max current |
| Signal Integrity | 12-bit ADC resolution (0.01% error), 1ns jitter |
| Environmental Rating | Operating temp: -40 C to +85 C, IP54 dust/water resistance |
| EMC Compliance | FCC Part 15 Class B, CE EN55032 |
| Manufacturer | Representative Products |
|---|---|
| Arduino | Arduino MKR Shield, Nano I/O Breakout |
| Raspberry Pi | Pico W Expansion Board, HAT+ Prototyping |
| STMicroelectronics | ST-Link/V2 Debugger, X-NUCLEO Expansion |
| Texas Instruments | LaunchPad SensorHub, BoosterPack MKII |
Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources
Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization