Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	HQPACK144SD Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	CY3212-16SOIC Cypress Semiconductor	KIT FLEX POD FOR CY8C21X 16-SOIC	0
	NQPACK208SD Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	MB2132-464 Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	CY3083-07 Cypress Semiconductor	MATRIX CARD FOR HI-LO PROG	0
	MB2144-221-01 Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	HQPACK052SB Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	SK-91460-91F467D-208PFV Cypress Semiconductor	STARTER KIT	0
	HQPACK176SD Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	CY3208-POD Cypress Semiconductor	MCU PSOC EMU POD FOR CY8C24X FAM	0
	MB2142-11 Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	HQPACK064SD Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	CY3694 Cypress Semiconductor	SOCKET ADAPTER FTG FOR CY27EE16	0
	CYCD-PSOCTRAINING Cypress Semiconductor	ACCESSORY TRAINING KIT PSOC	0
	CY3211-48MLF Cypress Semiconductor	KIT FLEX POD FOR CY8C29X 48-QFN	0
	CY3656-32MLF Cypress Semiconductor	KIT FLEX POD CY7C60323-LFXC	0
	MB2144-211-01A Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	NQ-PACK160SB Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	MB2144-215-01 Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	MB2132-497 Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization