Accessories

Image Part Number Description / PDF Quantity Rfq
HW-AFX-SMA-HSSDC2

HW-AFX-SMA-HSSDC2

Xilinx

CONVERSION MODULE SMA - HSSDC2

0

HW-136-PC44

HW-136-PC44

Xilinx

ADAPTER FOR 44-PLCC XCR3000XL

0

HW-136-FT256

HW-136-FT256

Xilinx

ADAPTER FOR 256-FBGA XCR3000XL

0

HW-133-FG256

HW-133-FG256

Xilinx

ADAPTER FOR 256-FBGA XC9500XL

0

HW-MP-TQ144

HW-MP-TQ144

Xilinx

ADAPTER 144-TQFP COOLRUNNER II

0

HW-136-TQ144

HW-136-TQ144

Xilinx

ADAPTER FOR 144-TQFP XCR3000XL

0

HW-MLX10-RACK-G

HW-MLX10-RACK-G

Xilinx

CHASSIS 1U RACK MOUNT 19"

0

HW-133-BG256

HW-133-BG256

Xilinx

ADAPTER FOR 256-BGA XC9500XL/XV

0

HW-AFX-SMA-SATA

HW-AFX-SMA-SATA

Xilinx

CONVERSION MODULE SMA - SATA

0

HW-137-PC44/VQ44

HW-137-PC44/VQ44

Xilinx

ADAPTER 44-PLCC/VQFP XC17V00/18V

0

HW-136-CP56

HW-136-CP56

Xilinx

ADAPTER FOR 56-CSP XCR3000XL

0

HW-136-CS48

HW-136-CS48

Xilinx

ADAPTER FOR 48-CSP XCR3000XL

0

UP-S6-EMBD-CONN-G

UP-S6-EMBD-CONN-G

Xilinx

KIT EVAL SPARTAN 6

0

HW-MP-FT256

HW-MP-FT256

Xilinx

ADAPTER 256-FBGA COOLRUNNER II

0

HW-136-CS280

HW-136-CS280

Xilinx

ADAPTER FOR 280-CSP XCR3000XL

0

HW-AFX-BERG-SDRAM

HW-AFX-BERG-SDRAM

Xilinx

EXPANSION MOD SDRAM BERG-SDRAM

0

HW-MP-PC44-2

HW-MP-PC44-2

Xilinx

ADAPTER 44-PLCC COOLRUNNER II

0

HW-MP-SO20

HW-MP-SO20

Xilinx

ADAPTER 20-SOIC XC18V00 PROM

0

HW-133-VQ64

HW-133-VQ64

Xilinx

ADAPTER 64-VQFP XC9500XL/XV

0

HW-137-SO20

HW-137-SO20

Xilinx

ADAPTER FOR 20-SOIC XC17S00A

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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