Accessories

Image Part Number Description / PDF Quantity Rfq
HW-MP-VQ100

HW-MP-VQ100

Xilinx

ADAPTER 100-VQFP COOLRUMMER II

0

HW-133-HQ208

HW-133-HQ208

Xilinx

ADAPTER 208QFP/HQFP XC9500XL/XV

0

HW-137-PC20/SO20

HW-137-PC20/SO20

Xilinx

ADAPTER 20-PLCC/SOIC XC1700/S00

0

HW-MP-PQ208

HW-MP-PQ208

Xilinx

ADAPTER 208QFP COOLRUNNER II

0

HW-133-TQ144

HW-133-TQ144

Xilinx

ADAPTER 144-TQFP XC9500XL/XV

0

HW-MP-CP132

HW-MP-CP132

Xilinx

ADAPTER 132CSP COOLRUNNER II

0

HW-MP-VO48

HW-MP-VO48

Xilinx

ADAPTER 48-TSOP FLASH PROM

0

HW-137-DIP8

HW-137-DIP8

Xilinx

ADAPTER 8-DIP XC1700/XC17S00/XL

0

HW-XGI-VIDEO-US

HW-XGI-VIDEO-US

Xilinx

DAUGHTER CARD VIDEO I/O VIODC

0

HW-PCIE-SMA-G

HW-PCIE-SMA-G

Xilinx

MODULE CONV PCIE-SMA

0

HW-136-FG324

HW-136-FG324

Xilinx

ADAPTER FOR 324-FBGA XCR3000XL

0

HW-133-BG352

HW-133-BG352

Xilinx

ADAPTER FOR 352-BGA SC9500

0

HW-FMC-VIDEO-DC-G

HW-FMC-VIDEO-DC-G

Xilinx

HARDWARE FMC-VIDEO DAUGHTER CARD

0

HW-MP-VQ44-2

HW-MP-VQ44-2

Xilinx

ADAPTER 44-VQFP COOLRUNNER II

0

HW-LVDS-CBL-80

HW-LVDS-CBL-80

Xilinx

CABLE COAX LVDS 13" BLUE RIBBON

0

HW-133-PQ160

HW-133-PQ160

Xilinx

ADAPTER FOR 160QFP XC9500

0

HW-MP-PC44-1

HW-MP-PC44-1

Xilinx

ADAPTER 44-PLCC XC18V00 PROM

0

HW-FMC-DBG-G

HW-FMC-DBG-G

Xilinx

FMC DEBUG MEZZANINE CARD

0

HW-133-CS144

HW-133-CS144

Xilinx

ADAPTER FOR 144-CSP XC9500XL/XV

0

HW-133-VQ44

HW-133-VQ44

Xilinx

ADAPTER 44-VQFP XC9500/XL/XV

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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