Accessories

Image Part Number Description / PDF Quantity Rfq
HW-DMB-1-G

HW-DMB-1-G

Xilinx

CABLE PROGRAM ALVEO

13

HW-LICENSE-DONGLE-USB-G

HW-LICENSE-DONGLE-USB-G

Xilinx

USB DONGLE ISE DESIGN SUITE

13

HW-FMC-XM105-G

HW-FMC-XM105-G

Xilinx

FMC XM105 CONNECTIVITY CARD

187

HW-RIBBON14

HW-RIBBON14

Xilinx

CABLE FOR CABLE IV OR MULTIPRO

0

HW-USB-FLYLEADS-G

HW-USB-FLYLEADS-G

Xilinx

BOARD ADAPTER AND FLY LEADS

50

HW-FMC-XM104-G

HW-FMC-XM104-G

Xilinx

FMC XM104 CONNECTIVITY CARD

0

HW-PWAC-2600317

HW-PWAC-2600317

Xilinx

HW ALVEO CARD RA PWR ADAPT

16

HW-FMC-XM101-G

HW-FMC-XM101-G

Xilinx

HARDWARE FMC INTERFACE CARD

0

HW-MUSB-3090122

HW-MUSB-3090122

Xilinx

CABLE USB A MALE TO USB B U280

30

HW-MUSB-3090136

HW-MUSB-3090136

Xilinx

CABLE MICRO USB ALVEO U200/U250

33

HW-CRII-PM-ACC-G

HW-CRII-PM-ACC-G

Xilinx

KIT STARTER COOLRUNNER-II BUNDLE

0

HW-FLYLEADS

HW-FLYLEADS

Xilinx

LEAD WIRES FLYING CABLE III/IV

0

HW-PC4

HW-PC4

Xilinx

CABLE PROGRAMMING FOR XILINX DEV

0

HW-PC4-MS

HW-PC4-MS

Xilinx

CABLE MOUSE SPLITTER FOR HW-PC4

0

HW-136-PQ208

HW-136-PQ208

Xilinx

ADAPTER FOR 208QFP XCR3000XL

0

HW-MP-CP56

HW-MP-CP56

Xilinx

ADAPTER 56CSP COOLRUNNER II

0

HW-MP-PC20

HW-MP-PC20

Xilinx

ADAPTER 20-PLCC XC18V00 PROM

0

HW-136-CS144

HW-136-CS144

Xilinx

ADAPTER FOR 144-CSP XCR3000XL

0

HW-XGI-SCLK-G

HW-XGI-SCLK-G

Xilinx

MODULE SUPER CLOCK

0

HW-133-CS280

HW-133-CS280

Xilinx

ADAPTER FOR 280-CSP XC9500XL/XV

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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