Accessories

Image Part Number Description / PDF Quantity Rfq
HW-133-CS48

HW-133-CS48

Xilinx

ADAPTER FOR 48-CSP XC9500

0

HW-AFX-BERG-EPHY

HW-AFX-BERG-EPHY

Xilinx

DAUGHTER CARD PHY BERG-EPHY

0

HW-MULTILINX

HW-MULTILINX

Xilinx

CABLE DOWNLOAD FOR MULTILINX

0

UP-S6-SP605-CONN-G

UP-S6-SP605-CONN-G

Xilinx

KIT EVAL SPARTAN 6 SP605

0

HW-MP-FS48

HW-MP-FS48

Xilinx

ADAPTER FOR FLASH PROM 48-TFBGA

0

HW-133-PC84

HW-133-PC84

Xilinx

ADAPTER

0

HW-130-CAL

HW-130-CAL

Xilinx

CALIBRATION ADAPTER FOR HW-130

0

HW-AFX-SMA-RJ45

HW-AFX-SMA-RJ45

Xilinx

CONVERSION MODULE SMA - RJ45

0

HW-MP-FG324

HW-MP-FG324

Xilinx

ADAPTER 324FBGA COOLRUNNER II

0

HW-MP-QF48

HW-MP-QF48

Xilinx

ADAPTER 48-QFP COOLRUNNER II

0

HW-136-VQ44

HW-136-VQ44

Xilinx

ADAPTER FOR 44-VQFP XCR3000XL

0

HW-133-PC44

HW-133-PC44

Xilinx

ADAPTER

0

HW-AFX-SMA-SFP

HW-AFX-SMA-SFP

Xilinx

CONVERSION MODULE SMA - SFP

0

HW-MP-VQ44-1

HW-MP-VQ44-1

Xilinx

ADAPTER 44-VQFP XC1800V00 PROM

0

HW-MP-QF32

HW-MP-QF32

Xilinx

ADAPTER 32-QFP COOLRUNNER II

0

HW-137-PC20/SO8

HW-137-PC20/SO8

Xilinx

ADAPTER 20PLCC/8SOIC XC1700/S00

0

HW-133-TQ100

HW-133-TQ100

Xilinx

ADAPTER 100-TQFP XC9500/XL/XV

0

HW-AFX-SMA-NQSL-G

HW-AFX-SMA-NQSL-G

Xilinx

NQSL NELCO QUAD SERIAL LOOP

0

HW-133-PQ100

HW-133-PQ100

Xilinx

ADAPTER FOR 100QFP XC9500

0

HW-MP-VO20

HW-MP-VO20

Xilinx

ADAPTER 20-TSSOP FLASH PROM

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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