| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Basler |
DART I/O BOARD STARTER KIT |
6 |
|
 |
Analog Devices, Inc. |
CABLE USB TO SRL I/O INTERFACE |
43 |
|
 |
Terasic |
PCIE X4 CBL ADAPTER PCA GEN 3 |
49 |
|
 |
Sanyo Semiconductor/ON Semiconductor |
DEMO 3 ADAPTER |
0 |
|
 |
Bridgetek |
CABLE USB A-MICRO B 1M BLW/WHT |
5 |
|
 |
Digilent, Inc. |
IR PROXIMITY SENSOR 2 PACK |
5 |
|
 |
Digilent, Inc. |
ZYBO Z7-20 FAN KIT |
9 |
|
 |
Digilent, Inc. |
2-PIN MTE CABLE 9INCH PACK OF 5 |
0 |
|
 |
Xilinx |
CABLE FOR CABLE IV OR MULTIPRO |
0 |
|
 |
Digilent, Inc. |
GETTING STARTED WITH CHIPKIT |
0 |
|
 |
INTERFACE DVI-D FOR BEAGLEBONE |
39 |
|
|
 |
Texas Instruments |
MOTOR SERVO 60V |
10 |
|
 |
Roving Networks / Microchip Technology |
PIC18F26K83 PIM |
5 |
|
 |
Analog Devices, Inc. |
THERMOCOUPLE BOARD |
5 |
|
 |
MikroElektronika |
SMARTADAPT MINI BOARD |
0 |
|
 |
SchmartBoard |
10" MALE PIC PROGRAMMING CABLE |
4 |
|
 |
Basler |
DART I/O BOARDS (5 PIECES) |
5 |
|
 |
Future Technology Devices International, Ltd. |
POWER SUPPLY FOR VNCLO-MB1A UK |
0 |
|
 |
IR (Infineon Technologies) |
EVALUATION DAUGHTER BOARD |
17 |
|
 |
Roving Networks / Microchip Technology |
EXTENSION PAK PIC18LF14K22-ICE |
0 |
|
Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.
| Type | Functional Features | Application Examples |
|---|---|---|
| Interface Cables | High-speed data transfer, hot-plugging support | USB-UART converters, HDMI breakout cables |
| Power Modules | Regulated voltage output, battery management | Lipo battery packs, DC-DC converters |
| Sensor Modules | Digital/analog signal acquisition, calibration-free | Temperature/humidity sensors, IMUs |
| Expansion Boards | Peripheral interface extension, protocol conversion | Motor drivers, LoRaWAN shields |
| Debugging Tools | Real-time tracing, voltage measurement | JTAG probes, logic analyzers |
Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads
| Parameter | Description |
|---|---|
| Interface Compatibility | Supports USB 3.0, SPI up to 10MHz, I2C 400kHz |
| Power Handling | 1.8V-24V input range, 5A max current |
| Signal Integrity | 12-bit ADC resolution (0.01% error), 1ns jitter |
| Environmental Rating | Operating temp: -40 C to +85 C, IP54 dust/water resistance |
| EMC Compliance | FCC Part 15 Class B, CE EN55032 |
| Manufacturer | Representative Products |
|---|---|
| Arduino | Arduino MKR Shield, Nano I/O Breakout |
| Raspberry Pi | Pico W Expansion Board, HAT+ Prototyping |
| STMicroelectronics | ST-Link/V2 Debugger, X-NUCLEO Expansion |
| Texas Instruments | LaunchPad SensorHub, BoosterPack MKII |
Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources
Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization