Accessories

Part Number	Description / PDF	Quantity
UPPIF960-A-EK Silicon Labs	UDP UPPI MCU CARD	1
QF1D512-EZ430	BOARD MSP-MOJO + EXPANSION HEADR	4
JLINK-ARM-AD Future Designs, Inc.	ADAPTER 20-PIN JTAG FOR ARM	21
4D PROGRAMMING CABLE 4D Systems	MICROUSB PROGRAMMING ADAPTER	64
114991790 Seeed	CORAL USB ACCELERATOR	0
BBC Matrix Orbital	DEVELOPMENT CABLE	0
110990030 Seeed	GROVE 2MM 4PIN VERT CONN 10PCS	379
VNCLO-PSU-EU Future Technology Devices International, Ltd.	POWER SUPPLY FOR VNCLO-MB1A EU	0
AC11C60A Roving Networks / Microchip Technology	BIST XPLAINED PRO	0
EV94F66A Roving Networks / Microchip Technology	PIC32CM MOTOR CONTROL PIM	15
TC-R1 Phyton, Inc.	CABLE TRACE FOR PICE-52 EMULATOR	0
MSCNC4031U-10 Roving Networks / Microchip Technology	NSHIELD EDGE HSM USB DEVICE	0
MA180016 Roving Networks / Microchip Technology	MODULE PLUG-IN PICDEM HPC BLANK	6
20-101-0541 Digi	MODULE LCD/KEYPAD PANEL MOUNT	46
1932 Adafruit	40PIN TFT FPC BREAKOUT LED DRVR	29
CY3250-286XXQFN Cypress Semiconductor	KIT EMULATION EMERALD CY8C286XXX	3
6003-300-000 Digilent, Inc.	POWER SUPPLY 60W	43
MA240041 Roving Networks / Microchip Technology	PIC24FJ512GU410 GP PIM	11
MA330031 Roving Networks / Microchip Technology	MOD PIM DSPIC33EP256MC506 INT OA	4
TLK10002FPGAEVM Texas Instruments	BOARD DAUGHTER FPGA FOR TLK10002	1

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization