Accessories

Part Number	Description / PDF	Quantity
250-047 Digilent, Inc.	UART CROSSOVER CABLE 6 PIN 6INCH	0
STEVAL-PCC009V3 STMicroelectronics	BOARD EVAL S-TOUCH STM32	0
SHIELD-EKG-EMG-PRO Olimex	PASSIVE ELECTRODE FOR SHIELD	15
DM320005-2 Roving Networks / Microchip Technology	BOARD EXPANSION II PIC32	0
ACICE0105 Roving Networks / Microchip Technology	MPLABICE PARALLEL CABLE	2
GEN4-4DPI SERIAL ADAPTOR 4D Systems	PROGRAMMING SERIAL ADAPTER GEN4	9
IMX-MIPI-HDMI NXP Semiconductors	IMX-MIPI-HDMI	13
805-00006 Parallax, Inc.	CABLE USB A TO MINI B	0
CMAXQUSB+ Maxim Integrated	MODULE COMMAND SMBUS/I2C	38
321070032 Seeed	RASPBERRY PI B+ 40-26PIN CBL	0
R-78S3.3-0.1-EVM-1/STM-1 RECOM Power	ACCESSORY FOR R-78S3.3-0.1-EVM-1	20
MIKROE-315 MikroElektronika	BOARD ICD2 CONNECTOR	49
AC160214-1 Roving Networks / Microchip Technology	BOARD DEV LIGHTING DALI ADAPTER	2
MTSAS-DK Multi-Tech Systems, Inc.	SOCKETMODEM ADAPTER SHIELD	6
MAXQUSBJTAGOW-KIT# Maxim Integrated	MAXQ USB-JTAG 1-WIRE LOADER EVKI	939
ATARD-DBGADPT Roving Networks / Microchip Technology	DEBUG ADAPTER FOR ARDUINO XPRO	0
24AA64-I/MNY-P9038V254MM Renesas Electronics America	IDT PROGRAMMED 24AA64T-I/MNY	0
PRT-14426 SparkFun	QWIIC CABLE - 50MM	981
TC2050-CLIP Tag-Connect	BOARD RETAINING FOR TC2050-NL	0
MA300016 Roving Networks / Microchip Technology	MODULE PLUG-IN DSPICDEM 80TQFP	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization