Accessories

Image Part Number Description / PDF Quantity Rfq
4841

4841

Adafruit

OBD PLUG (16-PIN) TO DE-9 (DB-9)

50

MA320024

MA320024

Roving Networks / Microchip Technology

PIC32MK1024 MOTOR CONTROL PIM

14

CVM001M

CVM001M

TechTools

MEMBER MOD PIC16C55X/62X/CE62X

0

ADAM

ADAM

4D Systems

ADAPTER BOARD 4DLCD-FT843

10

MA330045

MA330045

Roving Networks / Microchip Technology

DSPIC33CH512MP508 MOTOR CONTROL

5

3570

3570

Adafruit

SMARTIPI TOUCH BACK COVER - LARG

0

EA-EDU-011

EA-EDU-011

Embedded Artists

EXPANSION BOARD EXPERIMENT

0

HSC-ADC-EVALCZ

HSC-ADC-EVALCZ

Analog Devices, Inc.

KIT EVAL ADC FIFO HI SPEED

32

MIKROE-1134

MIKROE-1134

MikroElektronika

ETHERNET ROLL CABLE TRANSPARENT

0

BOOSTXL-C2KLED

BOOSTXL-C2KLED

Texas Instruments

BOOSTER PACK LED C2000

76

ADIS16IMU1/PCBZ

ADIS16IMU1/PCBZ

Analog Devices, Inc.

BREAKOUT IMU INTERFACE BOARD

20

OCB100AZ

OCB100AZ

TT Electronics / Optek Technology

BOARD CALIBR CIRCUIT PCB MNT

99

1986

1986

Adafruit

DOWNGRADE GPIO RIBBON CABLE FOR

0

FIT0586

FIT0586

DFRobot

HIGH QUALITY GOLD PLATED XT30 MA

212

LS400-18

LS400-18

LogiSwitch

ARDUINO WB W LS18 DEBOUNCE IC

106

AC162096

AC162096

Roving Networks / Microchip Technology

HEADER MPLAB ICD2 PIC16F526 8/14

0

PCM16XW0

PCM16XW0

Roving Networks / Microchip Technology

MODULE PROCESSOR PIC16C781/782

1

CY3250-24X23AQFN-POD

CY3250-24X23AQFN-POD

IR (Infineon Technologies)

PSOC POD FOR CY8C24X23 QFN

0

EHJ5C

EHJ5C

Advanced Linear Devices, Inc.

CABLE OUTPUT FOR EH42 MODULE

0

2202545

2202545

Phoenix Contact

BUS CONNECTOR TO CONNECT BC MODU

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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