Terminals - PC Pin Receptacles, Socket Connectors

Image Part Number Description / PDF Quantity Rfq
D01-9821401

D01-9821401

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

H3161-01

H3161-01

Harwin

CONN PIN RCPT .035-.041 KNURL

6893

H3194-01

H3194-01

Harwin

CONN PIN RCPT .035-.041 SOLDER

5035

D01-9902001

D01-9902001

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9900301

D01-9900301

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

H3163-01

H3163-01

Harwin

CONN PIN RCPT .035-.041 PRESSFIT

3163

D01-9791601

D01-9791601

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9840801

D01-9840801

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

H3153-01

H3153-01

Harwin

CONN PIN RCPT .018-.020 SOLDER

15506

H3190-01

H3190-01

Harwin

CONN PIN RCPT .018-.020 SOLDER

1540

S9131-45R

S9131-45R

Harwin

CONN PIN RCPT .031-.051 SOLDER

1388

H3169-05

H3169-05

Harwin

CONN PIN RCPT .035-.041 KNURL

0

H3169-01

H3169-01

Harwin

CONN PIN RCPT .035-.041 KNURL

1768

H3190-05

H3190-05

Harwin

CONN PIN RCPT .018-.020 SOLDER

587

H3175-01

H3175-01

Harwin

CONN PIN RCPT .016-.021 PRESSFIT

12760

S9121-45R

S9121-45R

Harwin

CONN PIN RCPT .059-0.075 SOLDER

2564

H8504-01

H8504-01

Harwin

CONN PIN RCPT .024-.033 SOLDER

2215

D01-9900805

D01-9900805

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9900401

D01-9900401

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9901601

D01-9901601

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

Terminals - PC Pin Receptacles, Socket Connectors

1. Overview

PC Pin Receptacles and Socket Connectors are fundamental components in electronic systems, providing secure electrical connections between printed circuit boards (PCBs) and other devices. These connectors enable modular design, ease of maintenance, and reliable signal/power transmission. Their importance spans across computing, telecommunications, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Right-Angle Pin Receptacles90 orientation for space optimizationDesktop motherboard peripheral connections
Through-Hole Socket ConnectorsHigh mechanical stability with PCB via mountingIndustrial control panel interfaces
High-Density Array ConnectorsMiniaturized contacts for compact designsSmartphone board-to-board connections
Power Pin ReceptaclesHeavy-duty contacts for high-current applicationsServer power distribution units

3. Structure and Components

Typical construction includes:

  • Insulating housing (LCP/PBT thermoplastic materials)
  • Contact springs (phosphor bronze with gold plating)
  • Polarization keying features
  • PCB mounting retention mechanisms
  • EMI shielding layers (for high-frequency variants)

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power handling capacity
Contact Resistance5-20m Impacts signal integrity
Dielectric Withstanding Voltage500V-1kVSafety isolation requirement
Mating Cycles500-10,000 cyclesService life indicator
Operating Temperature-55 C to +125 CEnvironmental reliability

5. Application Fields

Primary industries:

  • Computer hardware (motherboards, GPUs)
  • Telecom infrastructure (5G base stations)
  • Automotive electronics (ECUs, sensors)
  • Medical devices (diagnostic equipment)
  • Aerospace systems (avionics modules)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE ConnectivityMICRO MATCH Series0.8mm contact spacing, 3A rating
Amphenol ICCSmartArray High-Speed Socket10Gbps data rate capability
MolexPicoBlade Connector SystemSpace-saving 1.25mm pitch design
SamtecSEARAY High-Density ArrayUp to 4,000+ contact positions

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage needs)
  • Environmental conditions (temperature/humidity range)
  • Space constraints (board layout limitations)
  • Service life expectations (maintenance frequency)
  • Compliance standards (RoHS, REACH, IPC-6012)

8. Industry Trends Analysis

Emerging developments include:

  • Miniaturization (sub-0.5mm contact pitch research)
  • High-speed signal optimization (5G/6G compatibility)
  • Integrated EMI shielding solutions
  • Advanced plating materials (nanocoatings for corrosion resistance)
  • Smart connector integration (embedded sensors for predictive maintenance)
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