Terminals - PC Pin Receptacles, Socket Connectors

Image Part Number Description / PDF Quantity Rfq
D01-9820401

D01-9820401

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

H8504-05

H8504-05

Harwin

CONN PIN RCPT .024-.033 SOLDER

7886

H8505-01

H8505-01

Harwin

CONN PIN RCPT .023-.033 SOLDER

3655

D01-9842001

D01-9842001

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

H3161-05

H3161-05

Harwin

CONN PIN RCPT .035-.041 KNURL

5975

H3165-05

H3165-05

Harwin

CONN PIN RCPT .035-.041 KNURL

0

H3490-01

H3490-01

Harwin

CONN PIN RCPT .079 SOLDER

1407

H3191-05

H3191-05

Harwin

CONN PIN RCPT .018-.020 SOLDER

904

D01-9821201

D01-9821201

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

H8502-01

H8502-01

Harwin

CONN PIN RCPT .023-.033 KNURL

2138

D01-9900601

D01-9900601

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9821001

D01-9821001

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9901701

D01-9901701

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9900801

D01-9900801

Harwin

CONN PIN RCPT .016-.020 SOLDER

184

D01-9900901

D01-9900901

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

S8071-46R

S8071-46R

Harwin

CONN PIN RCPT .028 SOLDER

27839

D01-9791201

D01-9791201

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

S9111-45R

S9111-45R

Harwin

CONN PIN RCPT .059-0.075 SOLDER

2649

D01-9823201

D01-9823201

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9822001

D01-9822001

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

Terminals - PC Pin Receptacles, Socket Connectors

1. Overview

PC Pin Receptacles and Socket Connectors are fundamental components in electronic systems, providing secure electrical connections between printed circuit boards (PCBs) and other devices. These connectors enable modular design, ease of maintenance, and reliable signal/power transmission. Their importance spans across computing, telecommunications, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Right-Angle Pin Receptacles90 orientation for space optimizationDesktop motherboard peripheral connections
Through-Hole Socket ConnectorsHigh mechanical stability with PCB via mountingIndustrial control panel interfaces
High-Density Array ConnectorsMiniaturized contacts for compact designsSmartphone board-to-board connections
Power Pin ReceptaclesHeavy-duty contacts for high-current applicationsServer power distribution units

3. Structure and Components

Typical construction includes:

  • Insulating housing (LCP/PBT thermoplastic materials)
  • Contact springs (phosphor bronze with gold plating)
  • Polarization keying features
  • PCB mounting retention mechanisms
  • EMI shielding layers (for high-frequency variants)

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power handling capacity
Contact Resistance5-20m Impacts signal integrity
Dielectric Withstanding Voltage500V-1kVSafety isolation requirement
Mating Cycles500-10,000 cyclesService life indicator
Operating Temperature-55 C to +125 CEnvironmental reliability

5. Application Fields

Primary industries:

  • Computer hardware (motherboards, GPUs)
  • Telecom infrastructure (5G base stations)
  • Automotive electronics (ECUs, sensors)
  • Medical devices (diagnostic equipment)
  • Aerospace systems (avionics modules)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE ConnectivityMICRO MATCH Series0.8mm contact spacing, 3A rating
Amphenol ICCSmartArray High-Speed Socket10Gbps data rate capability
MolexPicoBlade Connector SystemSpace-saving 1.25mm pitch design
SamtecSEARAY High-Density ArrayUp to 4,000+ contact positions

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage needs)
  • Environmental conditions (temperature/humidity range)
  • Space constraints (board layout limitations)
  • Service life expectations (maintenance frequency)
  • Compliance standards (RoHS, REACH, IPC-6012)

8. Industry Trends Analysis

Emerging developments include:

  • Miniaturization (sub-0.5mm contact pitch research)
  • High-speed signal optimization (5G/6G compatibility)
  • Integrated EMI shielding solutions
  • Advanced plating materials (nanocoatings for corrosion resistance)
  • Smart connector integration (embedded sensors for predictive maintenance)
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