Terminals - PC Pin Receptacles, Socket Connectors

Image Part Number Description / PDF Quantity Rfq
D01-9901501

D01-9901501

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9900505

D01-9900505

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

H3194-05

H3194-05

Harwin

CONN PIN RCPT .035-.041 SOLDER

0

D01-9841001

D01-9841001

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9901001

D01-9901001

Harwin

CONN PIN RCPT .016-.020 SOLDER

2678

H3191-01

H3191-01

Harwin

CONN PIN RCPT .018-.020 SOLDER

6222

D01-9843201

D01-9843201

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9900701

D01-9900701

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9841401

D01-9841401

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

S9101-46R

S9101-46R

Harwin

CONN PIN RCPT .043-.071 SMD

0

H3185-05

H3185-05

Harwin

CONN PIN RCPT .035-.041 SOLDER

8019

H3192-01

H3192-01

Harwin

CONN PIN RCPT .018-.020 SOLDER

55597

H3184-01

H3184-01

Harwin

CONN PIN RCPT .035-.041 PRESSFIT

6919

D01-9791001

D01-9791001

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

H8505-05

H8505-05

Harwin

CONN PIN RCPT .023-.033 SOLDER

0

H8501-01

H8501-01

Harwin

CONN PIN RCPT .023-.033 KNURL

1358

S9091-46R

S9091-46R

Harwin

CONN PIN RCPT .031-.059 SMD

69428

H3182-01

H3182-01

Harwin

CONN PIN RCPT .035-.041 SOLDER

5896

D01-9902301

D01-9902301

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

H3192-05

H3192-05

Harwin

CONN PIN RCPT .018-.020 SOLDER

7572

Terminals - PC Pin Receptacles, Socket Connectors

1. Overview

PC Pin Receptacles and Socket Connectors are fundamental components in electronic systems, providing secure electrical connections between printed circuit boards (PCBs) and other devices. These connectors enable modular design, ease of maintenance, and reliable signal/power transmission. Their importance spans across computing, telecommunications, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Right-Angle Pin Receptacles90 orientation for space optimizationDesktop motherboard peripheral connections
Through-Hole Socket ConnectorsHigh mechanical stability with PCB via mountingIndustrial control panel interfaces
High-Density Array ConnectorsMiniaturized contacts for compact designsSmartphone board-to-board connections
Power Pin ReceptaclesHeavy-duty contacts for high-current applicationsServer power distribution units

3. Structure and Components

Typical construction includes:

  • Insulating housing (LCP/PBT thermoplastic materials)
  • Contact springs (phosphor bronze with gold plating)
  • Polarization keying features
  • PCB mounting retention mechanisms
  • EMI shielding layers (for high-frequency variants)

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power handling capacity
Contact Resistance5-20m Impacts signal integrity
Dielectric Withstanding Voltage500V-1kVSafety isolation requirement
Mating Cycles500-10,000 cyclesService life indicator
Operating Temperature-55 C to +125 CEnvironmental reliability

5. Application Fields

Primary industries:

  • Computer hardware (motherboards, GPUs)
  • Telecom infrastructure (5G base stations)
  • Automotive electronics (ECUs, sensors)
  • Medical devices (diagnostic equipment)
  • Aerospace systems (avionics modules)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE ConnectivityMICRO MATCH Series0.8mm contact spacing, 3A rating
Amphenol ICCSmartArray High-Speed Socket10Gbps data rate capability
MolexPicoBlade Connector SystemSpace-saving 1.25mm pitch design
SamtecSEARAY High-Density ArrayUp to 4,000+ contact positions

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage needs)
  • Environmental conditions (temperature/humidity range)
  • Space constraints (board layout limitations)
  • Service life expectations (maintenance frequency)
  • Compliance standards (RoHS, REACH, IPC-6012)

8. Industry Trends Analysis

Emerging developments include:

  • Miniaturization (sub-0.5mm contact pitch research)
  • High-speed signal optimization (5G/6G compatibility)
  • Integrated EMI shielding solutions
  • Advanced plating materials (nanocoatings for corrosion resistance)
  • Smart connector integration (embedded sensors for predictive maintenance)
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