Terminals - PC Pin Receptacles, Socket Connectors

Image Part Number Description / PDF Quantity Rfq
D01-9791401

D01-9791401

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9842401

D01-9842401

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9900201

D01-9900201

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9820301

D01-9820301

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9901905

D01-9901905

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9821501

D01-9821501

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9840601

D01-9840601

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9901305

D01-9901305

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9901105

D01-9901105

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9901301

D01-9901301

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9900405

D01-9900405

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9840401

D01-9840401

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9841601

D01-9841601

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9821601

D01-9821601

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9901605

D01-9901605

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9901005

D01-9901005

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9902005

D01-9902005

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9820805

D01-9820805

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9901705

D01-9901705

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

D01-9840501

D01-9840501

Harwin

CONN PIN RCPT .016-.020 SOLDER

0

Terminals - PC Pin Receptacles, Socket Connectors

1. Overview

PC Pin Receptacles and Socket Connectors are fundamental components in electronic systems, providing secure electrical connections between printed circuit boards (PCBs) and other devices. These connectors enable modular design, ease of maintenance, and reliable signal/power transmission. Their importance spans across computing, telecommunications, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Right-Angle Pin Receptacles90 orientation for space optimizationDesktop motherboard peripheral connections
Through-Hole Socket ConnectorsHigh mechanical stability with PCB via mountingIndustrial control panel interfaces
High-Density Array ConnectorsMiniaturized contacts for compact designsSmartphone board-to-board connections
Power Pin ReceptaclesHeavy-duty contacts for high-current applicationsServer power distribution units

3. Structure and Components

Typical construction includes:

  • Insulating housing (LCP/PBT thermoplastic materials)
  • Contact springs (phosphor bronze with gold plating)
  • Polarization keying features
  • PCB mounting retention mechanisms
  • EMI shielding layers (for high-frequency variants)

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power handling capacity
Contact Resistance5-20m Impacts signal integrity
Dielectric Withstanding Voltage500V-1kVSafety isolation requirement
Mating Cycles500-10,000 cyclesService life indicator
Operating Temperature-55 C to +125 CEnvironmental reliability

5. Application Fields

Primary industries:

  • Computer hardware (motherboards, GPUs)
  • Telecom infrastructure (5G base stations)
  • Automotive electronics (ECUs, sensors)
  • Medical devices (diagnostic equipment)
  • Aerospace systems (avionics modules)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE ConnectivityMICRO MATCH Series0.8mm contact spacing, 3A rating
Amphenol ICCSmartArray High-Speed Socket10Gbps data rate capability
MolexPicoBlade Connector SystemSpace-saving 1.25mm pitch design
SamtecSEARAY High-Density ArrayUp to 4,000+ contact positions

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage needs)
  • Environmental conditions (temperature/humidity range)
  • Space constraints (board layout limitations)
  • Service life expectations (maintenance frequency)
  • Compliance standards (RoHS, REACH, IPC-6012)

8. Industry Trends Analysis

Emerging developments include:

  • Miniaturization (sub-0.5mm contact pitch research)
  • High-speed signal optimization (5G/6G compatibility)
  • Integrated EMI shielding solutions
  • Advanced plating materials (nanocoatings for corrosion resistance)
  • Smart connector integration (embedded sensors for predictive maintenance)
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