Modular Connectors - Jacks With Magnetics

Image Part Number Description / PDF Quantity Rfq
0857281003

0857281003

Woodhead - Molex

CONN JACK 12PORT 1000 BASE-T PCB

0

0857912020

0857912020

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

0

0937535320

0937535320

Woodhead - Molex

CONN JACK 1PORT 100 BASE-T PCB

214

0857913020

0857913020

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

0

0857911020

0857911020

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

359

0857931006

0857931006

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

839396

0938283026

0938283026

Woodhead - Molex

MXMAG DUAL PORT 4 CORE FE W/ LED

0

0857271002

0857271002

Woodhead - Molex

CONN JACK 8PORT 1000 BASE-T PCB

56

0936263508

0936263508

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

0

0936263006

0936263006

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

0

0936273608

0936273608

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

0

0480250091

0480250091

Woodhead - Molex

CONN JACK 1PORT 100 BASE-T PCB

2991

0480250002

0480250002

Woodhead - Molex

CONN JACK 1PORT 100 BASE-T PCB

1080

0857910020

0857910020

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

388

0857931012

0857931012

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

667

0937698628

0937698628

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

1

0936268520

0936268520

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

235

0857271003

0857271003

Woodhead - Molex

CONN JACK 8PORT 1000 BASE-T PCB

153

0857931014

0857931014

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

0

0938288020

0938288020

Woodhead - Molex

CONN JACK DUAL PORT 4 CORE FE

0

Modular Connectors - Jacks With Magnetics

1. Overview

Modular connectors with integrated magnetics are hybrid components combining standard modular jack interfaces (e.g., RJ45) with built-in magnetic circuits. These devices enable signal transmission while providing galvanic isolation and noise suppression. They are critical in Ethernet communications, industrial networking, and telecommunication systems where signal integrity and electromagnetic compatibility (EMC) are essential.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RJ45 MagJackIntegrated common-mode chokes, 10/100/1000BASE-T supportEthernet switches, routers
Surface Mount MagJackLow-profile SMD design, reduced PCB footprintIndustrial IoT devices
High-Speed MagJackUp to 10GBASE-T support, optimized for <1GHz frequenciesData center servers
POE-Enabled MagJackSupports Power-over-Ethernet (PoE/PoE+)IP cameras, VoIP phones

3. Structure and Components

Typical construction includes: - Plastic housing (LCP/PBT materials) with integrated latch mechanism - Precision-machined copper alloy contacts (gold-plated for durability) - Toroidal magnetic cores for common-mode noise suppression - PCB mounting terminals with insulation displacement design - Shielding cage for EMI protection in high-speed variants

4. Key Technical Specifications

ParameterTypical ValueImportance
Frequency Range100MHz-1GHzDetermines data transmission rate
Insulation Resistance>1G Ensures electrical safety
Rated Current1.5A per contactPOE power handling capability
VSWR<1.3:1Measures signal integrity
Mechanical Life500-1000 mating cyclesProduct durability

5. Application Fields

Primary applications across: - Telecommunications: Central office switches, DSLAMs - Industrial Automation: PLCs, SCADA systems - Consumer Electronics: Smart TVs, gaming consoles - Transportation: In-vehicle networking, railway control systems - Medical Devices: MRI machines, patient monitoring equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE Connectivity1-1418809-310GBASE-T support, -40 C to +85 C rating
Amphenol51001001Integrated LED indicators, PoE++ compatible
Molex0878650011Shielded design, 1.27mm pitch SMD
Bel Stewart94330101EAuto-transformer function, UL94 V-0 rating

7. Selection Guidelines

Key considerations: 1. Electrical Requirements: Match data rate and PoE specifications 2. Mechanical Constraints: Check PCB footprint and mating dimensions 3. Environmental Factors: Temperature range and humidity resistance 4. Compliance: Verify IEEE 802.3 and RoHS certifications 5. Cost-Performance Ratio: Balance durability with budget limitations

8. Industry Trends

Current development trends include: - Migration to 25/100GBASE-T for data centers - Miniaturization for mobile device integration - Enhanced PoE support (up to 71W) - Integration with active circuitry (smart jacks) - Development of eco-friendly lead-free soldering solutions

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