| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Woodhead - Molex |
CONN JACK 12PORT 1000 BASE-T PCB |
0 |
|
 |
Woodhead - Molex |
CONN JACK 1PORT 1000 BASE-T PCB |
1252 |
|
 |
Woodhead - Molex |
CONN JACK 1PORT 1000 BASE-T PCB |
297 |
|
 |
Woodhead - Molex |
CONN JACK 1PORT 100 BASE-TX PCB |
58 |
|
 |
Woodhead - Molex |
CONN JACK 1PORT 1000 BASE-T PCB |
560 |
|
 |
Woodhead - Molex |
CONN JACK MXMAG DUAL PORT 8CORE |
0 |
|
|
Woodhead - Molex |
CONN JACK 1PORT 1000 BASE-T PCB |
0 |
|
|
Woodhead - Molex |
CONN JACK 8PORT 1000 BASE-T PCB |
0 |
|
|
Woodhead - Molex |
CONN JACK MXMAG DUAL PORT 8CORE |
0 |
|
|
Woodhead - Molex |
CONN JACK 8PORT 1000 BASE-T PCB |
0 |
|
|
Woodhead - Molex |
CONN JACK 1PORT 100 BASE-TX PCB |
0 |
|
|
Woodhead - Molex |
CONN JACK 8PORT 1000 BASE-T PCB |
0 |
|
|
Woodhead - Molex |
CONN JACK 12PORT 1000 BASE-T PCB |
0 |
|
|
Woodhead - Molex |
CONN JACK 1PORT 100 BASE-TX PCB |
0 |
|
|
Woodhead - Molex |
CONN JACK 1PORT 1000 BASE-T PCB |
0 |
|
|
Woodhead - Molex |
CONN JACK 1PORT 100 BASE-T PCB |
0 |
|
|
Woodhead - Molex |
CONN JACK 8PORT 1000 BASE-T PCB |
0 |
|
|
Woodhead - Molex |
CONN JACK 8PORT PCB |
0 |
|
|
Woodhead - Molex |
CONN JACK 12PORT 1000 BASE-T PCB |
0 |
|
|
Woodhead - Molex |
CONN JACK 1PORT 10G BASE-T PCB |
0 |
|
Modular connectors with integrated magnetics are hybrid components combining standard modular jack interfaces (e.g., RJ45) with built-in magnetic circuits. These devices enable signal transmission while providing galvanic isolation and noise suppression. They are critical in Ethernet communications, industrial networking, and telecommunication systems where signal integrity and electromagnetic compatibility (EMC) are essential.
| Type | Functional Features | Application Examples |
|---|---|---|
| RJ45 MagJack | Integrated common-mode chokes, 10/100/1000BASE-T support | Ethernet switches, routers |
| Surface Mount MagJack | Low-profile SMD design, reduced PCB footprint | Industrial IoT devices |
| High-Speed MagJack | Up to 10GBASE-T support, optimized for <1GHz frequencies | Data center servers |
| POE-Enabled MagJack | Supports Power-over-Ethernet (PoE/PoE+) | IP cameras, VoIP phones |
Typical construction includes: - Plastic housing (LCP/PBT materials) with integrated latch mechanism - Precision-machined copper alloy contacts (gold-plated for durability) - Toroidal magnetic cores for common-mode noise suppression - PCB mounting terminals with insulation displacement design - Shielding cage for EMI protection in high-speed variants
| Parameter | Typical Value | Importance |
|---|---|---|
| Frequency Range | 100MHz-1GHz | Determines data transmission rate |
| Insulation Resistance | >1G | Ensures electrical safety |
| Rated Current | 1.5A per contact | POE power handling capability |
| VSWR | <1.3:1 | Measures signal integrity |
| Mechanical Life | 500-1000 mating cycles | Product durability |
Primary applications across: - Telecommunications: Central office switches, DSLAMs - Industrial Automation: PLCs, SCADA systems - Consumer Electronics: Smart TVs, gaming consoles - Transportation: In-vehicle networking, railway control systems - Medical Devices: MRI machines, patient monitoring equipment
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| TE Connectivity | 1-1418809-3 | 10GBASE-T support, -40 C to +85 C rating |
| Amphenol | 51001001 | Integrated LED indicators, PoE++ compatible |
| Molex | 0878650011 | Shielded design, 1.27mm pitch SMD |
| Bel Stewart | 94330101E | Auto-transformer function, UL94 V-0 rating |
Key considerations: 1. Electrical Requirements: Match data rate and PoE specifications 2. Mechanical Constraints: Check PCB footprint and mating dimensions 3. Environmental Factors: Temperature range and humidity resistance 4. Compliance: Verify IEEE 802.3 and RoHS certifications 5. Cost-Performance Ratio: Balance durability with budget limitations
Current development trends include: - Migration to 25/100GBASE-T for data centers - Miniaturization for mobile device integration - Enhanced PoE support (up to 71W) - Integration with active circuitry (smart jacks) - Development of eco-friendly lead-free soldering solutions