Modular Connectors - Jacks With Magnetics

Image Part Number Description / PDF Quantity Rfq
0480251091

0480251091

Woodhead - Molex

CONN JACK 1PORT 100 BASE-T PCB

0

0857352001

0857352001

Woodhead - Molex

CONN JACK 8PORT PCB

0

0857591001

0857591001

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

0

0857281001

0857281001

Woodhead - Molex

CONN JACK 12PORT 1000 BASE-T PCB

0

0937678126

0937678126

Woodhead - Molex

CONN JACK 1PORT 100 BASE-T PCB

83

0938243020

0938243020

Woodhead - Molex

CONN JACK MXMAG DUAL PORT 4CORE

0

0857893006

0857893006

Woodhead - Molex

CONN JACK 1PORT AUTOMDIX PCB

0

0936273606

0936273606

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

0

0938258020

0938258020

Woodhead - Molex

CONN JACK MXMAG DUAL PORT 6CORE

0

0857351004

0857351004

Woodhead - Molex

CONN JACK 8PORT 1000 BASE-T PCB

0

0934635205

0934635205

Woodhead - Molex

CONN JACK 1PORT 100 BASE-T PCB

0

0857271004

0857271004

Woodhead - Molex

CONN JACK 8PORT 1000 BASE-T PCB

0

0857281004

0857281004

Woodhead - Molex

CONN JACK 12PORT 1000 BASE-T PCB

0

0857801005

0857801005

Woodhead - Molex

CONN JACK 12PORT 1000 BASE-T PCB

0

0480749001

0480749001

Woodhead - Molex

CONN JACK 1PORT 100 BASE-T SMD

0

0480250092

0480250092

Woodhead - Molex

CONN JACK 1PORT AUTOMDIX PCB

0

0855861005

0855861005

Woodhead - Molex

CONN JACK 12PORT 1000 BASE-T PCB

0

0855861003

0855861003

Woodhead - Molex

CONN JACK 8PORT 1000 BASE-T PCB

0

0480334900

0480334900

Woodhead - Molex

CONN JACK 16PORT 100 BASE-T PCB

0

0936260001

0936260001

Woodhead - Molex

CONN JACK 8 CORE GIG 0.85

0

Modular Connectors - Jacks With Magnetics

1. Overview

Modular connectors with integrated magnetics are hybrid components combining standard modular jack interfaces (e.g., RJ45) with built-in magnetic circuits. These devices enable signal transmission while providing galvanic isolation and noise suppression. They are critical in Ethernet communications, industrial networking, and telecommunication systems where signal integrity and electromagnetic compatibility (EMC) are essential.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RJ45 MagJackIntegrated common-mode chokes, 10/100/1000BASE-T supportEthernet switches, routers
Surface Mount MagJackLow-profile SMD design, reduced PCB footprintIndustrial IoT devices
High-Speed MagJackUp to 10GBASE-T support, optimized for <1GHz frequenciesData center servers
POE-Enabled MagJackSupports Power-over-Ethernet (PoE/PoE+)IP cameras, VoIP phones

3. Structure and Components

Typical construction includes: - Plastic housing (LCP/PBT materials) with integrated latch mechanism - Precision-machined copper alloy contacts (gold-plated for durability) - Toroidal magnetic cores for common-mode noise suppression - PCB mounting terminals with insulation displacement design - Shielding cage for EMI protection in high-speed variants

4. Key Technical Specifications

ParameterTypical ValueImportance
Frequency Range100MHz-1GHzDetermines data transmission rate
Insulation Resistance>1G Ensures electrical safety
Rated Current1.5A per contactPOE power handling capability
VSWR<1.3:1Measures signal integrity
Mechanical Life500-1000 mating cyclesProduct durability

5. Application Fields

Primary applications across: - Telecommunications: Central office switches, DSLAMs - Industrial Automation: PLCs, SCADA systems - Consumer Electronics: Smart TVs, gaming consoles - Transportation: In-vehicle networking, railway control systems - Medical Devices: MRI machines, patient monitoring equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE Connectivity1-1418809-310GBASE-T support, -40 C to +85 C rating
Amphenol51001001Integrated LED indicators, PoE++ compatible
Molex0878650011Shielded design, 1.27mm pitch SMD
Bel Stewart94330101EAuto-transformer function, UL94 V-0 rating

7. Selection Guidelines

Key considerations: 1. Electrical Requirements: Match data rate and PoE specifications 2. Mechanical Constraints: Check PCB footprint and mating dimensions 3. Environmental Factors: Temperature range and humidity resistance 4. Compliance: Verify IEEE 802.3 and RoHS certifications 5. Cost-Performance Ratio: Balance durability with budget limitations

8. Industry Trends

Current development trends include: - Migration to 25/100GBASE-T for data centers - Miniaturization for mobile device integration - Enhanced PoE support (up to 71W) - Integration with active circuitry (smart jacks) - Development of eco-friendly lead-free soldering solutions

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