Modular Connectors - Jacks With Magnetics

Image Part Number Description / PDF Quantity Rfq
0857891007

0857891007

Woodhead - Molex

CONN JACK 1PORT 10G BASE-T PCB

0

0937555225

0937555225

Woodhead - Molex

CONN JACK 1PORT 100 BASE-T PCB

0

0857271001

0857271001

Woodhead - Molex

CONN JACK 8PORT 1000 BASE-T PCB

0

0857321001

0857321001

Woodhead - Molex

CONN JACK 12PORT 1000 BASE-T PCB

0

0857271008

0857271008

Woodhead - Molex

CONN JACK 8PORT 1000 BASE-T PCB

0

0857351006

0857351006

Woodhead - Molex

CONN JACK 8PORT 1000 BASE-T PCB

0

0857271012

0857271012

Woodhead - Molex

CONN JACK 8PORT 1000 BASE-T PCB

0

0857351001

0857351001

Woodhead - Molex

CONN JACK 8PORT 1000 BASE-T PCB

0

0857352004

0857352004

Woodhead - Molex

CONN JACK 8PORT PCB

0

0857321004

0857321004

Woodhead - Molex

CONN JACK 12PORT 1000 BASE-T PCB

0

0936343206

0936343206

Woodhead - Molex

CONN JACK 1PORT 100 BASE-T PCB

0

0857181001

0857181001

Woodhead - Molex

CONN JACK 2PORT 100 BASE-T PCB

0

0857933006

0857933006

Woodhead - Molex

CONN JACK 1PORT AUTOMDIX PCB

0

0938243006

0938243006

Woodhead - Molex

CONN JACK MXMAG DUAL PORT 4CORE

0

0936268020

0936268020

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

0

0857591006

0857591006

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

0

0857591003

0857591003

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

0

0857591012

0857591012

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

0

0938263006

0938263006

Woodhead - Molex

MXMAG DUAL PORT 8 CORE GIG W/ LE

0

0857351002

0857351002

Woodhead - Molex

CONN JACK 8PORT 1000 BASE-T PCB

0

Modular Connectors - Jacks With Magnetics

1. Overview

Modular connectors with integrated magnetics are hybrid components combining standard modular jack interfaces (e.g., RJ45) with built-in magnetic circuits. These devices enable signal transmission while providing galvanic isolation and noise suppression. They are critical in Ethernet communications, industrial networking, and telecommunication systems where signal integrity and electromagnetic compatibility (EMC) are essential.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RJ45 MagJackIntegrated common-mode chokes, 10/100/1000BASE-T supportEthernet switches, routers
Surface Mount MagJackLow-profile SMD design, reduced PCB footprintIndustrial IoT devices
High-Speed MagJackUp to 10GBASE-T support, optimized for <1GHz frequenciesData center servers
POE-Enabled MagJackSupports Power-over-Ethernet (PoE/PoE+)IP cameras, VoIP phones

3. Structure and Components

Typical construction includes: - Plastic housing (LCP/PBT materials) with integrated latch mechanism - Precision-machined copper alloy contacts (gold-plated for durability) - Toroidal magnetic cores for common-mode noise suppression - PCB mounting terminals with insulation displacement design - Shielding cage for EMI protection in high-speed variants

4. Key Technical Specifications

ParameterTypical ValueImportance
Frequency Range100MHz-1GHzDetermines data transmission rate
Insulation Resistance>1G Ensures electrical safety
Rated Current1.5A per contactPOE power handling capability
VSWR<1.3:1Measures signal integrity
Mechanical Life500-1000 mating cyclesProduct durability

5. Application Fields

Primary applications across: - Telecommunications: Central office switches, DSLAMs - Industrial Automation: PLCs, SCADA systems - Consumer Electronics: Smart TVs, gaming consoles - Transportation: In-vehicle networking, railway control systems - Medical Devices: MRI machines, patient monitoring equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE Connectivity1-1418809-310GBASE-T support, -40 C to +85 C rating
Amphenol51001001Integrated LED indicators, PoE++ compatible
Molex0878650011Shielded design, 1.27mm pitch SMD
Bel Stewart94330101EAuto-transformer function, UL94 V-0 rating

7. Selection Guidelines

Key considerations: 1. Electrical Requirements: Match data rate and PoE specifications 2. Mechanical Constraints: Check PCB footprint and mating dimensions 3. Environmental Factors: Temperature range and humidity resistance 4. Compliance: Verify IEEE 802.3 and RoHS certifications 5. Cost-Performance Ratio: Balance durability with budget limitations

8. Industry Trends

Current development trends include: - Migration to 25/100GBASE-T for data centers - Miniaturization for mobile device integration - Enhanced PoE support (up to 71W) - Integration with active circuitry (smart jacks) - Development of eco-friendly lead-free soldering solutions

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