Memory Connectors - PC Card Sockets

Image Part Number Description / PDF Quantity Rfq
1041180811

1041180811

Woodhead - Molex

CONN MICRO SIM CARD PUSH-PUSH

0

0471500004

0471500004

Woodhead - Molex

CONN PCMCIA CARD PUSH-PUSH

0

5008730806

5008730806

Woodhead - Molex

CONN MICRO SD CARD PUSH-PUSH R/A

0

0671550002

0671550002

Woodhead - Molex

CONN COMPACT FLASH CARD R/A SMD

0

1050480001

1050480001

Woodhead - Molex

1.45MM LOW PROFILE SIM CARD CONN

0

0539275010

0539275010

Woodhead - Molex

CONN COMPACT FLASH CARD R/A SMD

0

0473880001

0473880001

Woodhead - Molex

CONN SIM CARD HINGED TYPE R/A

0

0912283001

0912283001

Woodhead - Molex

CONN SIM CARD PUSH-PUSH R/A SMD

0

5045280892

5045280892

Woodhead - Molex

MICRO SD CARD CONNECTOR

0

0679558001

0679558001

Woodhead - Molex

CONN SD CARD PUSH-PUSH R/A SMD

0

0538565010

0538565010

Woodhead - Molex

CONN COMPACT FLASH CARD R/A SMD

0

0550210001

0550210001

Woodhead - Molex

CONN COMPACT FLASH CARD SNAP-IN

0

0471500002

0471500002

Woodhead - Molex

CONN PCMCIA CARD PUSH-PULL R/A

0

0473095251

0473095251

Woodhead - Molex

CONN MICRO SD CARD PUSH-PULL R/A

0

5031820832

5031820832

Woodhead - Molex

CONN MICRO SD CARD PUSH-PUSH R/A

0

0943525007

0943525007

Woodhead - Molex

CONN MMC CARD PUSH-PULL R/A SMD

0

0480002001

0480002001

Woodhead - Molex

CONN SD/MMC/MS CARD PUSH-PUSH

0

0679138008

0679138008

Woodhead - Molex

CONN SD/MMC CARD PUSH-PUSH R/A

0

0552460011

0552460011

Woodhead - Molex

CONN COMPACT FLASH CARD SNAP-IN

0

1510320001

1510320001

Woodhead - Molex

CONN SIM CARD BLK STYLE SIDE ENT

0

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

TypePhysical Dimensions (mm)Functional FeaturesApplication Examples
Type I54 85.6 3.316-bit ISA bus, 68-pinMemory expansion cards
Type II54 85.6 5.016/32-bit bus supportModem, LAN adapters
Type III54 85.6 10.532-bit CardBus interfaceHard disk drives
ExpressCard54 75 5.0 or 34 75 5.0PCIe/GPIO interface, 26-pinHigh-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

  • Dielectric Housing: High-temperature resistant LCP material
  • Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
  • Actuation Mechanism: Ejector levers with tactile feedback
  • Locking System: Mechanical retention springs
  • EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)
The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance10-30m Signal integrity maintenance
Current Rating1.0A per contactPower delivery capability
Dielectric Withstand1000VACElectrical safety compliance
Operating Temperature-55 C to +85 CEnvironmental reliability
Mating Cycles10,000+Durability indicator

5. Application Fields

Primary industries include:

  • Consumer Electronics: Notebook computers, digital cameras
  • Industrial Automation: Programmable logic controllers (PLCs)
  • Medical Devices: Portable diagnostic equipment
  • Telecommunications: Wireless base stations
  • Military/Aerospace: Ruggedized computing systems
Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

ManufacturerKey Product SeriesTechnical Features
Amphenol ICC515 SeriesLow-profile Type II sockets
Molex47220 SeriesCardBus compatible
TE Connectivity1-1461885ExpressCard 34mm design
SamtecASP-200404High-speed differential pairs

7. Selection Guidelines

Key considerations:

  • Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
  • Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
  • Vibration Resistance: Select locking mechanisms for mobile applications
  • Thermal Management: Evaluate current carrying capacity under load
  • RoHS Compliance: Confirm lead-free termination options
Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

  • Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
  • Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
  • Multi-functionality: Integrated power/signal contacts
  • Material Innovation: Graphene-enhanced contact plating
  • Standard Evolution: Migration towards USB4/Thunderbolt compatibility
Market forecasts predict sustained demand in industrial sectors despite consumer market decline.

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