Memory Connectors - PC Card Sockets

Image Part Number Description / PDF Quantity Rfq
0787275001

0787275001

Woodhead - Molex

MICROSIM CONN 1.40MM HT PUSH/PUL

0

0473092285

0473092285

Woodhead - Molex

MICRO SD HEADER WITH D/C PIN

0

0912283005

0912283005

Woodhead - Molex

CONN SIM CARD PUSH-PUSH R/A SMD

0

1510580001

1510580001

Woodhead - Molex

MICRO BLOCK SIM CONN INSERT MOLD

0

0785450010

0785450010

Woodhead - Molex

2.54 SIM CARD CONN .3MM

0

0474688001

0474688001

Woodhead - Molex

CONN SIM CARD PUSH-PULL R/A SMD

0

0474680001

0474680001

Woodhead - Molex

CONN SIM CARD PUSH-PULL R/A SMD

0

0470191501

0470191501

Woodhead - Molex

SCALABLE SIM CONNECTOR 1.5 MM

0

0470192401

0470192401

Woodhead - Molex

CONN SCALABLE SIM 2.4MM 6CKT

0

0473092525

0473092525

Woodhead - Molex

TFR HEADER W/DETECT PIN

0

0528270611

0528270611

Woodhead - Molex

CONN SIM CARD PUSH-PUSH R/A SMD

0

0553585028

0553585028

Woodhead - Molex

CONN COMPACT FLASH CARD R/A SMD

12

1052932001

1052932001

Woodhead - Molex

MICRO SD HDR NOKIA 3.75 HT

0

2010300214

2010300214

Woodhead - Molex

MSD/NSIM 3IN2 1.45H VERTICAL TYP

0

5056032092

5056032092

Woodhead - Molex

3IN2 ANTI CRUSH CNC TRAY GEN

0

0473121001

0473121001

Woodhead - Molex

CONN SIM CARD PUSH-PULL R/A SMD

0

0470230001

0470230001

Woodhead - Molex

CONN SIM CARD HINGED TYPE R/A

0

0480500001

0480500001

Woodhead - Molex

CONN MINI SD CARD PUSH-PUSH R/A

0

1510590001

1510590001

Woodhead - Molex

CONN SIM CRD W/NANO SIM CRD SKT

0

0538565078

0538565078

Woodhead - Molex

CONN COMPACT FLASH CARD R/A SMD

0

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

TypePhysical Dimensions (mm)Functional FeaturesApplication Examples
Type I54 85.6 3.316-bit ISA bus, 68-pinMemory expansion cards
Type II54 85.6 5.016/32-bit bus supportModem, LAN adapters
Type III54 85.6 10.532-bit CardBus interfaceHard disk drives
ExpressCard54 75 5.0 or 34 75 5.0PCIe/GPIO interface, 26-pinHigh-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

  • Dielectric Housing: High-temperature resistant LCP material
  • Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
  • Actuation Mechanism: Ejector levers with tactile feedback
  • Locking System: Mechanical retention springs
  • EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)
The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance10-30m Signal integrity maintenance
Current Rating1.0A per contactPower delivery capability
Dielectric Withstand1000VACElectrical safety compliance
Operating Temperature-55 C to +85 CEnvironmental reliability
Mating Cycles10,000+Durability indicator

5. Application Fields

Primary industries include:

  • Consumer Electronics: Notebook computers, digital cameras
  • Industrial Automation: Programmable logic controllers (PLCs)
  • Medical Devices: Portable diagnostic equipment
  • Telecommunications: Wireless base stations
  • Military/Aerospace: Ruggedized computing systems
Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

ManufacturerKey Product SeriesTechnical Features
Amphenol ICC515 SeriesLow-profile Type II sockets
Molex47220 SeriesCardBus compatible
TE Connectivity1-1461885ExpressCard 34mm design
SamtecASP-200404High-speed differential pairs

7. Selection Guidelines

Key considerations:

  • Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
  • Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
  • Vibration Resistance: Select locking mechanisms for mobile applications
  • Thermal Management: Evaluate current carrying capacity under load
  • RoHS Compliance: Confirm lead-free termination options
Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

  • Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
  • Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
  • Multi-functionality: Integrated power/signal contacts
  • Material Innovation: Graphene-enhanced contact plating
  • Standard Evolution: Migration towards USB4/Thunderbolt compatibility
Market forecasts predict sustained demand in industrial sectors despite consumer market decline.

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